The word “mechatronics” was originally established by Yaskawa Electric Corporation in 1969. Originally a Japanese-English word that combined “mechanism” and “electronics,” it was registered as a trademark of the company in 1972. However, this word had already been used widely in the automation or manufacturing fields prior to its introduction. Currently, the company has renounced the trademark and the word “mechatronics” is used as a general term. It is used extensively not only in Japan but also overseas, and journals and books with the name “mechatronics” are widely distributed. In modern industry, a mechanical product is rarely composed of only a pure machine or mechanism; by contrast, a composition including electronic or information equipment is common. In other words, one can conclude that most mechanical products benefit from mechatronics.

In this special issue, topics pertaining to the research and development of a wide range of mechatronics, including the following topics, are welcome: Advanced mechatronics devices, robotics and AI (Artificial Intelligence), mechatronics sensing and control, smart actuators and materials, MEMS/ NEMS and micro/nano-manufacturing, precision measuring technology, production systems, renewable energy and smart grid, bioengineering and mechatronics applications in life sciences, information and networking, human resource development and education on mechatronics technology.

We welcome academic theory or analysis and technical reports, including practical cases.

Recent advances in 3D scanning and reconstruction technologies based on LiDAR and digital images enable flexible acquisition of geometric and appearance information from physical objects and environments. These technologies are currently essential for engineering product development and the maintenance of plants, factories, infrastructure, forests, and urban environments. In addition, reliable and efficient technologies for 3D acquisition, processing, recognition, modeling, and application of digital geometry data are becoming increasingly important for cyber-physical systems. The main objective of this special issue is to present the latest research results on digitized geometry processing using 3D scanning and reconstruction, as well as its applications across various fields. Related topics include, but are not limited to, the following:

• 3D scanning, reconstruction, and sensing technology, and systems for 3D geometry data
acquisition,
• Data processing algorithms, principles, and theory for the acquisition of 3D geometry data,
• Recognition and modeling from acquired 3D geometry data for objects and environments,
• Application of acquired 3D geometry data to automation and simulation technology.

The papers in this special issue present the latest advances in the application of 3D scanning and reconstruction technology. The sharing of these advances will help readers better explore and understand the technologies.

Over the last decade, agricultural robotics and mechatronics have advanced significantly. Notable examples include the commercialization of unmanned agricultural vehicles for cereal cultivation, as well as the development of artificial intelligence (AI) applications in agricultural image analysis rooted in field science. This special issue invites new “seeds” that directly or indirectly contribute to either the quantitative or qualitative aspects of food security. These include the development of smart mechanical (non-chemical) weeding automation applicable within or beyond field boundaries, improvements in the efficiency and safety of human–robot collaborative vegetable harvesters, enhancements of season-independent, versatile, and cost-effective field sensing and digitalization technologies, and the further development of AI and data science applications for design and analysis of agriculture-related components and systems, among other critical advancements.

A shift toward environmental sustainability and decarbonization requires a green transformation (GX) in manufacturing industries in order to improve competitiveness, and encourage carbon-neutral investment. Intensifying energy and resource sustainability in manufacturing technologies and related fields, such as design, planning, and logistics, has become the main focus in response to decarbonization, and the carbon footprint tied to these processes. The key challenges involve balancing production and sustainable costs while shifting understanding and behavior regarding GX.

This special issue explores various topics related to GX, and its role in enhancing cleaner production within manufacturing industries and related sectors. We invite original papers that focus on the following technologies, systems, and models:

• Sustainable manufacturing processes, including machining, assembling, material handling, storage, and measurement
• Circular economy technologies and systems, including advances in life cycle assessment and CO2 emissions reduction
• Energy-efficient planning and control process planning, production scheduling, and controls,
• Theory, model and algorithm for sustainable supply chain management
• Artificial intelligence-driven sustainability
• Other related technologies

Publication Date: January 20, 2026 (Vol.30 No.1)
(Papers will be published in the earliest issue after acceptance.)

All submitted papers will be reviewed by at least 2 referees.
All papers for JACIII should be not published previously or elsewhere. Thus, it is mandatory that the title of the paper should be different from the proceeding paper. In addition, recommended requirements are below:
 1) The contents should be 30% or more revised from the proceeding paper.
 2) The figures should be 50% or more different from the proceeding paper.

Today, social issues such as global environmental problems and a worker shortage are becoming more apparent, and society’s values are changing. The same happens to production processing technology, which is required not only to improve the functionality and reliability of manufactured products, but also to meet diversified needs, such as information technology, intelligence, and energy conservation, in addition to conventional high-speed and high-precision technology. To this end, various research and development activities are being conducted, including new machining methods such as additive manufacturing, technologies for monitoring machine conditions, and technologies for collaborative systems between operators, robots, and machines.

This special issue is composed of various topics in current production and processing technology, with this year marking the end of the first quarter of the 21st century. For example, we invite papers on the following technologies in production technology;

• High-speed, high-precision machining,
• Highly reliable measurement and evaluation technology,
• Flexible automation technology,
• Innovations in machine element technology,
• Intelligent information processing technology,
• And other related technologies.

Because of recent technological advancements and rapid changes in social structure, hands-on approaches to Science, Technology, Engineering, and Mathematics (STEM) and STEAM (STEM + Arts) education are attracting attention. We invite papers on a variety of topics for this special issue, from reports on practical applications of robotics and mechatronics that have produced results in actual educational settings to innovative proposals that have the potential to significantly impact education in the future. We expect to find papers on a variety of topics, including the following:

• Reports about experiential learning practices
Practical examples and reports are used in the field to improve the effectiveness of student learning.

• New educational methods that foster creativity and problem-solving skills
Proposals for technology-based approaches to education, such as 3D printing, robotics, and coding.

• Integration of the arts, science, and technology
Proposals to investigate new learning opportunities through the integration of the arts, science, and technology.

• The challenges of inclusive STEM/STEAM education
Case studies and reports on inclusive educational practices for diverse learners.

• Challenges for future
Proposals for new educational models and systems that consider both traditional and future technologies such as AI, robotics, and soft robotics.

In addition to these topics, studies on traditional educational methods are welcomed. Examples include project-based learning, evaluation methods that encourage learner initiative, and educational systems that use human-computer interaction. We are excited to work with you to shape the future of STEM/STEAM education through your research and practical reports.

In recent years, mobility technologies have advanced rapidly with innovative developments, such as autonomous driving and electric vehicles becoming more integrated into society. The adoption of vehicle-to-vehicle and vehicle-to-infrastructure communication to support connected cars is accelerating. Additionally, the use of advanced driver assistance systems (ADAS) powered by artificial intelligence (AI) and machine learning is increasing. Mobility as a service is also gaining momentum, enhancing the integration of vehicle intelligence with infrastructure, and accelerating the realization of autonomous driving. Moreover, the introduction of smart infrastructure is key to achieving safe and efficient urban transportation. In this special issue, we invite a wide range of cutting-edge studies in these areas. We welcome papers on, but not limited to, the following topics: prediction and control technologies related to autonomous driving vehicles and mobile robots, connected car technologies, AI and machine learning applications in ADAS, sensor fusion technologies, smart infrastructure integration, automotive cybersecurity, and practical implementations of simulation and design using digital twin technology. Through these research contributions, we aim to advance mobility technologies and their influences in shaping the future of society.

Chemical mechanical planarization/polishing (CMP) is one of the most important processes in the manufacturing of semiconductor devices, and it is being developed and improved continuously each year. CMP has gained prominence in related industries, and its application areas are expanding. From the user’s point of view, technical demand is increasing , as are additional applications beyond the semiconductor industry.

This special issue aims to provide researchers the opportunity to access the latest research and practical case studies on recent technologies, including FEOL and BEOL CMP, 3D/TSV, fundamentals of CMP, polishing processes, consumables, equipment, green devices, new applications, metrology, cleaning, defect control, process control, CMP alternatives, SiC, GaN, and sapphire and diamond. Topics of interest in this special issue include, but are not limited to, the following:

•FEOL CMP
•BEOL CMP
•Defects, reliability issues, and post-CMP cleaning
•CMP fundamentals, modeling, and simulation
•Equipment, process control, and metrology
•Emerging and alternative CMP technologies
•CMP consumables
•3D ICs/TSV/packaging applications
•CMP for MEMS and hybrid applications
•Substrate polishing, including Si, SiC, GaN, and Diamond

On January 1, 2024, a magnitude 7.6 earthquake struck the Noto Peninsula and nearby areas in Ishikawa Prefecture, Japan. The earthquake resulted from shallow reverse faulting along a 150-km stretch of the Japan Sea coast, followed by a tsunami one minute later. The disaster killed 260 people, injured 1,579, and damaged 125,736 residential buildings across Ishikawa, Fukui, Toyama, and Niigata prefectures.

After the quake, fires destroyed over 200 buildings across 50,000 square meters in Wajima City. Ground shaking triggered landslides and building collapses, while widespread liquefaction in urban areas from Niigata to Ishikawa prefectures further damaged infrastructure along the Japan Sea coast.

The heavy rain on September 21, 2024, in the Noto area caused flooding and landslides, setting back recovery efforts and compounding the challenges faced since the January earthquake.

As Japan continues to grapple with population decline and aging, the lessons from the 2024 Noto Peninsula earthquake, and subsequent heavy rainfall and flooding, provide critical insights for future disaster resilience. The Journal of Disaster Research is launching a special collection to consolidate knowledge on these events. We invite submissions from diverse fields, including natural sciences, engineering, humanities, and social sciences, to explore disaster resilience, regional planning, social vulnerability, public health, and related topics.

We welcome contributions not only from academics but also from professionals and practitioners with on-the-ground experience, in the form of not just research papers and reports, but notes, materials, and other submissions as well, to share Japan’s knowledge and lessons on disaster resilience with the world. To broaden participation and encourage a wider range of contributions, we have waived publication charges for submissions to this Collection. Please note that submissions should be limited to topics directly correlating to the recent Noto Peninsula disasters.

Given the dynamic and multifaceted nature of disasters, it is crucial to share research findings without delay and systematically document events from onset through recovery. Leveraging the flexibility of online publishing, we will not set a fixed submission deadline, and accepted submissions will be published on a rolling basis as they pass review. At the end of the year, these articles will be compiled into a comprehensive collection. We hope this new publication method will improve both the timeliness and accessibility of the valuable insights in this Collection.

Positioning systems play an important role in industrial and scientific applications. Therefore, their performance improvements and functional expansions are crucial. Positioning systems generally consist of mechanisms, actuators, controllers, and sensors, and the performance and functions of the system depend on their integration. Therefore, positioning technologies encompass these elements and their integration. Furthermore, technologies such as AI and IoT are being incorporated to improve the performance and functionalities, and expand the applications. This special issue aims to provide researchers with access to the latest research and practical case studies on elemental technologies for positioning, and industrial and peripheral technology applications. The topics of interest in this special issue include but are not limited to the following:

– Elemental technologies: Design and Characteristics of Mechanisms and Actuators, Control technology, Sensors, Measurement technology, System design, Simulations, Materials

– Industrial applications: Machine tools, Semiconductor manufacturing equipment, Measuring instruments, Robots, Scanning probe microscope

– Applications of peripheral technologies: AI, IoT, Signal processing, Image processing, DX, Green Technology.

The demand for sensing in robotics and automation is increasing with a decrease in labor force. Backed with recent developments in computational performance, image processing technology is widely used for various applications. This special issue aims to provide researchers the opportunity to access the latest research and practical case studies on advanced image processing, computer vision, and sensing techniques for robotics and automation. Topics of interest in this special issue include, but are not limited to, the following:

– Theory and algorithms: Image Processing, Computer Vision, Pattern Recognition, Object Detection, Image Understanding, Media Understanding, Machine Learning, Deep Learning, 3D Measurement, Simultaneous Localization and Mapping (SLAM), Multispectral Image Processing, Visualization, VR/AR/MR, Datasets for Image Processing

– Industrial applications: Factory Automation, Machine Vision, Visual Inspection, Monitoring, Surveying, Logistics

– Sensing techniques for robotics and automation: Robot Vision, Advanced Driver-Assistance Systems (ADAS), Autonomous Driving, Robotic Picking, Assembly, and Palletizing

– Image processing hardware and software: Image Acquisition Devices, Image Sensors, Image Processing Systems, Sensor Information Processing

– Man machine interface: Visualization, Human Interface Devices

Recent technological developments have expanded the range of applications and possibilities for industrial robots. This special issue calls for a wide range of papers from reports of successful practical applications to ambitious proposals that may significantly impact the field in the future, concerning the automation of manual work such as material handling in factories, logistics, commercial facilities, and public facilities, as well as elemental technologies and system integration for new work methods such as collaboration and remote operation. We expect not only papers on elemental technologies including traditional technologies such as computer vision, grasping, manipulation, mechatronics, control methods, robot hands, mechanisms, and actuators, but also proposals for the future with challenging technologies such as human–machine interactions, foundation models, generative AI, and soft robotics. In systems integration, we welcome articles on robot programming, mobile manipulators, and new automation system applications. Through this special issue, we hope to share with you the future of this historic industrial field.

Research has been ongoing on various types of soft robots in recent years. Soft robots with flexible mechanisms are expected to contribute greatly to the development of robotics, not only in industrial applications but also in various other applications, such as tasks involving robot-human interactions. Flexible mechanisms are not necessarily realized with flexible materials alone; they can also be realized by taking new approaches to conventional mechanisms. It is also desirable for sensors and various other components to be flexible so that they do not reduce the flexibility of a mechanism. The development of these mechanisms and elemental technologies will lead to the further development of soft robots. This special issue will feature papers on the structures and applications of soft mechanisms and soft elements, as well as on design and analysis methods and control techniques. We welcome many submissions so that we may contribute to the further development of soft robots.

Regular paper submission is always welcome. Submitted paper is reviewed at all times, and when it is accepted for publication, it will appear in the near issue.
一般投稿論文は常に受け付けております。随時査読を行い、採録になり次第出版日の近い号に掲載されます。

[in Japanese]
近年のロボットメカトロニクス技術の高度化複雑化に伴って，一つの研究室で完結することが難しくなりつつあります．そこで，大学等の研究機関では人と資財を集中するための組織として研究センターを設立して研究開発を進めています．本特集では，大学だけではなく企業や官公庁の研究機関の研究センターの最先端の研究成果を世界に発信する企画です．内容は研究センターの紹介のための概要１ページ（掲載料無料）とJournal paper またはDevelopment report を２～３編で構成します．なお，論文審査はこれまでの規程通りに行います．研究センター関係者のご投稿をお待ちしています．

[in English]
Recent advancements and sophistications in robotics and mechatronics technologies have created challenges for individual research groups to complete their work independently. Under these circumstances, research institutes, such as universities, have established research centers to promote advanced and sophisticated technological innovations by centralizing humans and material assets. This special issue is planned to globally expose the cutting-edge research outcomes from these research centers in universities as well as companies and governmental agencies. The contents of this special issue will consist of one-page brief introductions to these research centers (page-charge free) and of a few journal papers and development reports from each listed organization. The papers and reports submitted to this special issue will be peer-reviewed base on the regular rules of the journal. All members affiliated with such research centers are hereby cordially invited to contribute papers or reports to this special issue of the Journal of Robotics and Mechatronics. <PDF>

Always welcome

[in Japanese]
Journal of Robotics and Mechatronicsでは、大学の研究者による研究論文だけではなく、企業の技術者や大学・高専の学生による開発報告も募集しています。ロボティクス・メカトロニクスのシステム・技術を開発してみたが学術研究としてはまとめづらい場合であっても、自分たちの開発成果を読者に紹介したいという場合には、開発報告を書いてください。掲載されるとオンラインで無料公開され、世界中の読者に対して自分たちの成果を発信できます。英文誌ですが、英語で書くのが苦手な方でも、日本語で書いて出版社で翻訳することも可能です。開発現場での製品開発やロボット競技会での活動を通して達成した成果を、ぜひとも開発報告として投稿してください。

[in English]
The Journal of Robotics and Mechatronics (JRM) is calling for not only research papers from university researchers but also development reports from corporate engineers and university or college students. If you would like to present to our readers a system or technology you have developed in the field of robotics and mechatronics, you are encouraged to write a development report, even if you find difficulty in writing a research paper. Once published, your report will appear online free of charge and be shared with readers all over the world. JRM is an English journal, but if you are not confident in your English skills, you can write your report in Japanese and we will translate it for you. We are looking forward to receiving your development reports on, such as, product development in your company or an achievement in a robotics competition. <PDF>

[in Japanese]
近年、3Dプリンタが急速に注目を集めています。高性能化と低価格化を背景に、一般家庭でも3Dプリンタを所有できる時代になり、個人でも容易にデジタルデータからオリジナルの立体造形物を作り出すことが可能になりました。ものづくり革命の到来とも言われています。JRMでは、3Dプリンタによるものづくりの革新を特集するため、革新的な造形技術やモデリング技術、理工系教育への応用、などロボット・メカトロニクス分野への応用が期待される3Dプリンタの技術の報告を募集します。投稿者と読者の間でモデリングデータやノウハウを共有し、創造的アイデアのネットワークを形成していくことも狙いの１つです。大学や研究機関からはもちろん、企業からも、皆様の投稿をお待ちしております。

[in English]
The high performance and low price of 3D printers have made them available to ordinary homes and individuals. Nowadays original 3D objects can be easily produced by individuals using 3D printers. To focus on the innovation of manufacturing using 3D printers, we are calling for technical reports introducing 3D printer technologies applied to robotics and mechatronics fields. Examples include innovative shaping and modeling technology, scientific and technological education, and so on. One of our aims is to form a creative network among authors and readers through the sharing of modeling data and technical knowledge. Submissions are welcome from both academic institutions such as universities and laboratories and from commercial and other enterprises.
Details are given in the PDF.

Regular paper submissions are always welcome!

Regular paper submissions are always welcome!