single-au.php

IJAT Vol.7 No.6 pp. 644-653
doi: 10.20965/ijat.2013.p0644
(2013)

Paper:

Study on the Mechanical Properties of Lithium Tantalate and the Influence on its Machinability

Wei Hang*, Libo Zhou**, Jun Shimizu**,
Julong Yuan***, and Takeyuki Yamamoto**

*Graduate School of Science and Engineering, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi, Ibaraki 316-8511, Japan

**Faculty of Engineering, Ibaraki University, 4-12-1 Nakanarusawa, Hitachi, Ibaraki 316-8511, Japan

***Key Laboratory E&M, Zhejiang University of Technology, ChaoWang Road No.18, Hangzhou, Zhejiang Province, 310000, China

Received:
May 9, 2013
Accepted:
August 7, 2013
Published:
November 5, 2013
Keywords:
soft brittle materials, hard brittle materials, micro/nano-indentation, mechanical property, machinability
Abstract

As a typical multi-functional single crystal material, lithium tantalate (LiTaO3 or LT) exhibits its excellent electro-optical, piezoelectric properties and has now found many applications, such as electro-optical modulators, pyroelectric detectors, optical waveguide, piezoelectric transducers and SAW (Surface Acoustic Wave) substrates. Although LT is known as a very brittle material, however, detailed summaries of its mechanical properties and machinability are not readily available yet. In order to clarify and understand the fundamental mechanical properties of LT, micro/nano indentation tests are conducted in this study to evaluate elastic modulus, hardness and fracture toughness. Other two typical single crystals of silicon and sapphire are chosen for comparison. The obtained results are analyzed and discussed to understand their behaviors in elastic, plastic (ductile) and brittle regimes, and the influences on their machinability in the machining process.

Cite this article as:
W. Hang, L. Zhou, J. Shimizu, <. Yuan, and T. Yamamoto, “Study on the Mechanical Properties of Lithium Tantalate and the Influence on its Machinability,” Int. J. Automation Technol., Vol.7, No.6, pp. 644-653, 2013.
Data files:
References
  1. [1] Y. L. Shi, C. Zhang, and H. Zhang, et. al. “Low (sub-1-volt) halfwave voltage polymeric electro-optic modulators achieved by controlling chromophore shape,” Science, Vol.288, pp. 119-122, 2000.
  2. [2] S. G. Porter, “A brief guide to pyroelectric detectors,” Ferroelectrics, Vol.33, Issue 1, pp. 193-206, 1981.
  3. [3] W. B. Spillman, Jr. N. A. Sanford, and R. A. Soref, “Optical waveguides in LiTaO3 formed by proton exchange,” Optics Letters, Vol.8, Issue 9, pp. 497-498, 1983.
  4. [4] Y. Saito and H. Takao, “High Performance Lead-free Piezoelectric Ceramics in the (K,Na)NbO3-LiTaO3 Solid Solution System,” Optics Letters, Vol.338, Issue 1, pp. 17-32, 2006.
  5. [5] K. Länge, B. E. Rapp, andM. Rapp, “Surface acoustic wave biosensors: a review,” Anal Bioanal Chem, Vol.391, pp. 1509-1519, 2008.
  6. [6] Y. Q. Wu, H. Huang, J. Zou, and J. M. Dell, “Nanoscratch-induced deformation of single crystal silicon,” J. Vac. Sci. and Tech., Vol.27, Issue 3, pp. 1374-1378, 2009.
  7. [7] H. K. Tönshoff, W. V. Schmieden, I. Inasaki, et al., “Abrasive machining of silicon,” CIRP Ann., Vol.39, Issue 2, pp. 621-635, 1990.
  8. [8] L. Zhou, B. S. Hosseini, J. Shimizu, T. Tsuruga, et al., “Fabrication and evaluation for extremely thin Si wafer,” Int.. J. Abra. Tech., Vol.1, Issue 1, pp. 94-105, 2007.
  9. [9] S. Malkin and T. W. Hwang, “Grinding mechanisms for ceramics,” CIRP Ann., Vol.45, Issue 2, pp. 569-580, 1996.
  10. [10] L. Zhou, T. Shiina, Z. Qiu, J. Shimizu, et. al., “Research on chemomechanical grinding of large size quartz glass substrate,” Precision Engg., Vol.33, pp. 499-504, 2009.
  11. [11] T. G. Bifano, T. A. Dow, and R. O. Scattergood, “Ductle-regie grinding: A new technology for machining brittle materials,” ASME J. Eng’g for Industry, Vol.113, No.2, pp. 184-189, 1991.
  12. [12] M. F. Doerner and W. D. Nix, “A method for interpreting the data from depth-sensing indentation instruments,” J. Mater. Res., Vol.1, Issue 4, pp. 601-609, 1986.
  13. [13] D. L. Joslin and W. C. Oliver, “A new method for analyzing data from continuous depth-sensing microindentation tests,” J. Mater. Res., Vol.5, Issue 1, pp. 123-126, 1990.
  14. [14] I. N. Sneddon, “The relation between load and penetration in the axisymmetric boussinesq problem for a punch of arbitrary profile,” Int’l J. Engg. Sci, Vol.3, Issue 1, pp. 47-57, 1965.
  15. [15] W. Hang, L. Zhou, J. Shimizu, and J. Yuan, “A robust procedure of data analysis for micro/nano indentation,” Precision Engg., Vol.37, pp. 408-414, 2013.
  16. [16] W. C. Oliver and G. M. Pharr, “An improved technique for determining hardness and elastic modulus,” J. Mater. Res., Vol.7, No.6, pp. 1564-83, 1992.
  17. [17] USA Patient: No.P2004-233304A.
  18. [18] J. J.Worthman, “Young’s mudulus, shear modulus and poisson’s ratio in silicon and germanium,” J. App. Phy., Vol.36, Issue 1, pp. 153-156, 1965.
  19. [19] G. N. Merberg and J. A. Harrington, “Optical and mechanical properties of single-crystal sapphire optical fibers,” Applied Optics, Vol.32, Issue 18, pp. 3201-3209, 1993.
  20. [20] H. T. Young, H. T. Liao, and H. Y. Huang, “Novel method to investgate the critical depth of cut of ground silicon wafer,” J. Mater. Process. Tech., Vol.182, pp. 157-162, 2007.

*This site is desgined based on HTML5 and CSS3 for modern browsers, e.g. Chrome, Firefox, Safari, Edge, IE9,10,11, Opera.

Last updated on Nov. 19, 2019