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IJAT Vol.10 No.6 pp. 923-933
doi: 10.20965/ijat.2016.p0923
(2016)

Technical Paper:

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Whole Quenching of Small Thin Plate with Low-Power Semiconductor Laser Based on Feed-Speed Combination Problem

Yuki Manabe*,†, Ryosuke Oda*, Toshiki Hirogaki**, Eiichi Aoyama**, and Keiji Ogawa***

*Department of Science and Engineering, Doshisha University
1-3 Tataramiyakodani, Kyotanabe-shi, Kyoto 610-0394, Japan

†Corresponding author,

**Faculty of the Department of Science and Engineering, Doshisha University, Kyoto, Japan

***University of Shiga Prefecture, Shiga, Japan

Received:
May 2, 2016
Accepted:
September 27, 2016
Published:
November 4, 2016
Creative Commons License
Keywords:
laser heat treatment, laser forming, small power semiconductor laser, sustainable manufacturing, compact machine tools
Abstract
A furnace is used in the conventional quenching of small work pieces. When quenching is performed using a furnace, the electricity consumption is high because the heating is performed over a long time period. Moreover, the working environment is unsatisfactory because quenching oils and salt baths are used in the process. Laser quenching has attracted considerable attention as a method for addressing these issues. In previous studies of this method, a laser was used to perform whole quenching on a sheet. However, problems such as deformation and tempering can arise during whole quenching on a thin plate. Furthermore, it is difficult to determine appropriate feed speeds and scanning orders. Therefore, in this paper, we propose a quenching method that uses a semiconductor laser to reduce these thin plate quenching problems. Additionally, an evaluation function is provided for quantitatively assessing the feed speeds. We strive to determine the appropriate laser scanning order from an understanding of decreases in hardness and transformation. We then used the evaluation function to appropriately set the feed speed for the whole quenching of a thin plate using a laser. As a result, we were ultimately able to select a suitable feed speed at which whole quenching can be performed.
Cite this article as:
Y. Manabe, R. Oda, T. Hirogaki, E. Aoyama, and K. Ogawa, “Whole Quenching of Small Thin Plate with Low-Power Semiconductor Laser Based on Feed-Speed Combination Problem,” Int. J. Automation Technol., Vol.10 No.6, pp. 923-933, 2016.
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References
  1. [1] S. Hideki, “Trans. of the Japan Society of Precision Engineers,” Autumn Symposium, pp. 10-13, 2006 (in Japanese).
  2. [2] J. H. Lee, S. R. Park, and S. H. Yang, “Development of a miniaturized machine tool for machining a micro/meso scale structure, Proc. of Int. Conf. on Leading Edge Manufacturing in 21st Century,” Nov.3-6, pp. 157-162, 2003.
  3. [3] T. Taira and I. Tanabe, “Study on coefficient of friction about sliding surface of a minute part (influence of shape and specification on the sliding surface),” Proc. of Int. Conf. on Leading Edge Manufacturing in 21st Century, Nov. 3-6, pp. 163-168, 2003.
  4. [4] J. Magee, K. G. Watkins, and W. M. Steen, “Advances in laser forming,” J. of Laser APPI. Vol.10, p. 235, 1998.
  5. [5] E. C. Santos, M. Shiomi, K. Osakada, and T. Laouib, “Rapid manufacturing of metal components by laser forming,” Int. J. of Machine Tools and Manufacturing, Vol.46, pp. 1459-1468, 2006.
  6. [6] K. Ogawa, T. Hirogaki, S. N. Melkote, and S. Ogawa, “A Process Decision Making Strategy Based on Sustainability Evaluation,” Int. J. of Automation Technol., Vol.9, No.1, pp. 51-58, 2015.
  7. [7] S. Ogawa, T. Hirogaki, and E. Aoyama, “Environmentally-friendly laser hardening method with low power laser, Doshisha University Academic Repository,” Vol.51, pp. 65-70, 2010 (in Japanese).
  8. [8] R. Ueda, K. Yamada, S. Oikawa, and N. Hosokawa, “Basic research about laser forming, precision engineering,” J. of JSPE, Vol.67, No.2, pp. 300-305, 2001 (in Japanese).
  9. [9] T. Nakamura, S. Ishihara, H. Aoyama, N. Matsushita, and A. Ushimaru, “Basic Study on Laser Forming CAM System for Sheet Material Forming Without Dies or Molds,” Int. J. Automation Technol., Vol.4, No.5, pp. 447-453, 2010.
  10. [10] M. Nunobiki, M. Misawa, H. Shizuka, and K. Okuda, “Effect of pre-deformation on workpiece for laser bending,” J. of JSPE, pp. 3-4, 2012 (in Japanese).
  11. [11] H. Kakiuchi, T. Sazawa, T. Akiyama, and T. Kitamura, “Laser Forming Based on Geodesic Line In-plane Strain Method Instead of Plate Development Method by using Curvature Line,” J. of JWS, Vol.93, pp. 294-295, (in Japanese).
  12. [12] M. Kido, K. Okusada, T. Akiyama, and T. Kitamura, “Effect of the initial curvature radius on the transverse shrinkage and angular distortion in forming curved surface,” J. of JWS, Vol.93, pp. 290-291, 2013 (in Japanese).
  13. [13] Z. Hu, R. Kovacevic, and M. Labudovic, “Experimental and numerical modeling of buckling instability of laser sheet forming,” Int. J. of Machine Tools and Manufacture, Vol.42, pp. 1427-1439, 2002.
  14. [14] K. Ogawa, T. Hirogaki, S. N. Melkote, and S. Ogawa, “A process decision making strategy based on sustainability evaluation,” Int. J. Automation Technol., Vol.9, No.1, pp. 51-58, 2015.
  15. [15] M. Geiger and F. Vollertsen, “The mechanisms of laser forming,” CIRP Annals: Manufacturing Technology, Vol.42, No.1, pp. 301-304, 1993.
  16. [16] Y. Terauchi, H. Nadano, and M. Kohno, “On the Temperature Rise Caused by Moving Heat Source : 1st Report, Calculation of the Temperature under Three-Dimensional Heat Flow,” J. of JSME, Vol.49, No.444, pp. 1434-1440, 1983 (in Japanese).
  17. [17] O. Manca, B. Morrone and V. Naso, “Quasi-steady-state three-dimensional temperature distribution induced by a moving circular Gaussian heat source in a finite depth solid,” Int. J. of Heat and Mass Transfer, Vol.38, pp. 1305-1315, 1995.
  18. [18] J. Mazumder and W. M. Steen,“ Heat transfer model for cw laser material processing,” J. of Applied Physics, Vol.51, p. 941, 1980.
  19. [19] T. Hirogaki, H. Nakagawa, M. Hayamizu, Y. Kita, Y. Kakino, and I. Yamaji, “Heat Treatment of on-the-Machine Tools using YAG Laser Source : Heat Treatment on the Edge of a Die,” J. of JAPE, Vol.67, No.5, pp. 808-813, 2001 (in Japanese).
  20. [20] T. Hirogaki, H. Nakagawa, Y. Kobori, Y. Kida, and Y. Kakino, “In-situ heat treatment system using YAG laser source: tempering process after laser quenching,” J. of JSPE, Vol.68, No.12, pp. 1595-1599, 2002 (in Japanese).

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