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IJAT Vol.9 No.6 pp. 629-635
doi: 10.20965/ijat.2015.p0629
(2015)

Paper:

Efficient Fabrication Process of Metal Nanodot Arrays Using Direct Nanoimprinting Method with a Polymer Mold

Potejana Potejanasak*, Masahiko Yoshino*, Motoki Terano*, and Masahiro Mita**

*Department of Mechanical and Control Engineering, Tokyo Institute of Technology
2-12-1 Ookayama, Meguro-ku, Tokyo 152-8552, Japan

** Kyodo International Inc.
2-10-9 Miyazaki, Miyamae-ku, Kawasaki-shi, Kanagawa 216-003, Japan

Received:
May 1, 2015
Accepted:
September 16, 2015
Published:
November 5, 2015
Keywords:
gold nanodot, direct nanoimprinting, nanodot alignment and morphology, thermal dewetting, cyclo olefin polymer film
Abstract

A new fabrication process of metal nanodot arrays using the thermal dewetting method was developed in this study. This process was comprised of three steps: thin Au film deposition on a quartz glass substrate, groove patterning by direct nanoimprinting, and self-organization of metal nanodot arrays by thermal dewetting. A new idea to utilize a polymer film mold for groove patterning by direct nanoimprinting was examined. The polymer film mold was prepared by hot-embossing groove patterns of a mother mold on a cyclo olefin polymer (COP) film. The mother mold was prepared from a silicon wafer. The polymer film mold was used for direct nanoimprinting on a metal film deposited on a quartz substrate. The experimental results revealed that the COP film mold can effectively form a micro groove pattern on the Au film despite the COP film mold being softer than the Au film. The micro groove on the Au film was also found to be effective in aligning the nanodots in lines. The micro groove patterning using the COP film mold was also confirmed to be useful in controlling the dot size and alignment during the thermal dewetting process.

Cite this article as:
P. Potejanasak, M. Yoshino, M. Terano, and M. Mita, “Efficient Fabrication Process of Metal Nanodot Arrays Using Direct Nanoimprinting Method with a Polymer Mold,” Int. J. Automation Technol., Vol.9, No.6, pp. 629-635, 2015.
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Last updated on Aug. 19, 2019