Effect of Tool Run-Out on Micro-Groove Milling for a Microchannel Die

Kenichi Iwatsuka; Yukio Maeda; Takanori Yazawa; Shinya Suzuki

doi:10.20965/ijat.2014.p0275

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IJAT Vol.8 No.2 pp. 275-281

doi: 10.20965/ijat.2014.p0275

(2014)

Paper:

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Effect of Tool Run-Out on Micro-Groove Milling for a Microchannel Die

Kenichi Iwatsuka^, Yukio Maeda^, Takanori Yazawa^,
and Shinya Suzuki^*

^*Toyama Prefectural University, 5180 Kurokawa, Imizu-shi, Toyama 939-0398, Japan

^**Nagasaki University, 1-14 Bunkyo-machi, Nagasaki-shi, Nagasaki 852-8521, Japan

^***Nagano National College of Technology, 716 Tokuma, Nagano-shi, Nagano 381-8550, Japan

Received:

September 17, 2013

Accepted:

February 5, 2014

Published:

March 5, 2014

Keywords:

cutting, milling, microchannel chip die, cutting force, tool run-out

Abstract

Recently, the use of microchannel chips in micro total analysis systems, which can provide savings of natural resources and energy, has attracted attention in the medical field. Generally, the photolithography technology used in semiconductor manufacturing is used to manufacture microchannel chip dies. However, it involves several processes such as mask fabrication and the application of a photoresist to Si substrate, as well as expensive clean room facilities. In light of this, methods to form a fine groove using a micro-endmill are examined. The effects of the tool run-out of a few micrometers on micro-endmilling, as well as on the groove accuracy of a microgroove, are examined.

Cite this article as:

K. Iwatsuka, Y. Maeda, T. Yazawa, and S. Suzuki, “Effect of Tool Run-Out on Micro-Groove Milling for a Microchannel Die,” Int. J. Automation Technol., Vol.8 No.2, pp. 275-281, 2014.

Data files:

References

[1] N.-T. Nguyen and S. T. Wereley, “Fundamentals And Applications of Microfluidics,” Artech House, 2nd edition (Book).
[2] J. H. Parka, N.-E. Leea, J. Leea, J. S. Parkb, and H. D. Parkb, “Deep dry etching of borosilicate glass using SF6 and SF 6/Ar inductively coupled plasmas,” Microelectronic Engineering, Vol.82, pp. 119-128, 2005.
[3] T. Corman, P. Enoksson, and G. Stemme, “Deep wet etching of borosilicate glass using an anodically bonded silicon substrate as mask,” J. Micromech. Microeng, 8, pp.84-87, 2004.
[4] M. Jin, T. Goto, and T. Watanabe, “Relationship between cutting accuracy and main spindle imbalance in micro-endmilling (1st report) – Using two-flute square end mill with a diameter of 30µm –,” J. of the Japan Society for Abrasive Technology, Vol.54, No.9, pp. 22-26, 2010. (in Japanese)
[5] H. Shibahara, Y. Inada, M. Nunobiki, and K. Okuda, “Cutting Phenomena in Micro End Milling of Metal Mold Steel,” Trans. of the Japan Society of Mechanical Engineers (Series C), Vol.75, No.757, pp. 21-27, 2009. (in Japanese)
[6] M. Nomura, T. Kawashima, T. Shibata, Y. Murakami, M. Masuda, and O. Horiuchi, “Unique cutting phenomena in micro-end-milling – Mechanism and possibility of occurrence –,” J. of the Japan Society for Abrasive Technology, Vol.54, No.10, pp. 27-31, 2010. (in Japanese)
[7] K. Iwatsuka, Y. Maeda, H. Tanaka, T. Yazawa, and S. Suzuki, “Study on Micro-groove Milling of a Microchannel Die – Selection Guidelines for Cutting Conditions with Micro End Mills –,” Proc. of the 6th Int. Conf. on Leading Edge Manufacturing in 21st century (LEM21), 3273, 2011.
[8] Y. Maeda, K. Iwatsuka, Y. Isokawa, T. Yazawa, Y. Fukuda, and S. Suzuki, “Study on fine groove milling of micro-channel die – Surface roughness and form accuracy of fine groove –,” The 8th manufacturing & machine tool conf., pp. 249-250, 2010. (in Japanese)
[9] Y. Maeda, K. Iwatsuka, T. Yazawa, and Y. Fukuda, “Study on Micro-grooveMilling of aMicrochannel Die – Cutting performance of micro end mill –,” The Japan Society for Precision Engineering Hokuriku Shinetsu Brunch congress, pp. 3-4, 2009. (in Japanese)

This article is published under a Creative Commons Attribution-NoDerivatives 4.0 Internationa License.

[1] [1] N.-T. Nguyen and S. T. Wereley, “Fundamentals And Applications of Microfluidics,” Artech House, 2nd edition (Book).

[2] [2] J. H. Parka, N.-E. Leea, J. Leea, J. S. Parkb, and H. D. Parkb, “Deep dry etching of borosilicate glass using SF6 and SF 6/Ar inductively coupled plasmas,” Microelectronic Engineering, Vol.82, pp. 119-128, 2005.

[3] [3] T. Corman, P. Enoksson, and G. Stemme, “Deep wet etching of borosilicate glass using an anodically bonded silicon substrate as mask,” J. Micromech. Microeng, 8, pp.84-87, 2004.

[4] [4] M. Jin, T. Goto, and T. Watanabe, “Relationship between cutting accuracy and main spindle imbalance in micro-endmilling (1st report) – Using two-flute square end mill with a diameter of 30µm –,” J. of the Japan Society for Abrasive Technology, Vol.54, No.9, pp. 22-26, 2010. (in Japanese)

[5] [5] H. Shibahara, Y. Inada, M. Nunobiki, and K. Okuda, “Cutting Phenomena in Micro End Milling of Metal Mold Steel,” Trans. of the Japan Society of Mechanical Engineers (Series C), Vol.75, No.757, pp. 21-27, 2009. (in Japanese)

[6] [6] M. Nomura, T. Kawashima, T. Shibata, Y. Murakami, M. Masuda, and O. Horiuchi, “Unique cutting phenomena in micro-end-milling – Mechanism and possibility of occurrence –,” J. of the Japan Society for Abrasive Technology, Vol.54, No.10, pp. 27-31, 2010. (in Japanese)

[7] [7] K. Iwatsuka, Y. Maeda, H. Tanaka, T. Yazawa, and S. Suzuki, “Study on Micro-groove Milling of a Microchannel Die – Selection Guidelines for Cutting Conditions with Micro End Mills –,” Proc. of the 6th Int. Conf. on Leading Edge Manufacturing in 21st century (LEM21), 3273, 2011.

[8] [8] Y. Maeda, K. Iwatsuka, Y. Isokawa, T. Yazawa, Y. Fukuda, and S. Suzuki, “Study on fine groove milling of micro-channel die – Surface roughness and form accuracy of fine groove –,” The 8th manufacturing & machine tool conf., pp. 249-250, 2010. (in Japanese)

[9] [9] Y. Maeda, K. Iwatsuka, T. Yazawa, and Y. Fukuda, “Study on Micro-grooveMilling of aMicrochannel Die – Cutting performance of micro end mill –,” The Japan Society for Precision Engineering Hokuriku Shinetsu Brunch congress, pp. 3-4, 2009. (in Japanese)

Effect of Tool Run-Out on Micro-Groove Milling for a Microchannel Die

Kenichi Iwatsuka*, Yukio Maeda*, Takanori Yazawa**, and Shinya Suzuki***

Kenichi Iwatsuka^, Yukio Maeda^, Takanori Yazawa^,
and Shinya Suzuki^*