Effect of Tool Run-Out on Micro-Groove Milling for a Microchannel Die
Kenichi Iwatsuka*, Yukio Maeda*, Takanori Yazawa**,
and Shinya Suzuki***
*Toyama Prefectural University, 5180 Kurokawa, Imizu-shi, Toyama 939-0398, Japan
**Nagasaki University, 1-14 Bunkyo-machi, Nagasaki-shi, Nagasaki 852-8521, Japan
***Nagano National College of Technology, 716 Tokuma, Nagano-shi, Nagano 381-8550, Japan
Recently, the use of microchannel chips in micro total analysis systems, which can provide savings of natural resources and energy, has attracted attention in the medical field. Generally, the photolithography technology used in semiconductor manufacturing is used to manufacture microchannel chip dies. However, it involves several processes such as mask fabrication and the application of a photoresist to Si substrate, as well as expensive clean room facilities. In light of this, methods to form a fine groove using a micro-endmill are examined. The effects of the tool run-out of a few micrometers on micro-endmilling, as well as on the groove accuracy of a microgroove, are examined.
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