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IJAT Vol.5 No.5 pp. 694-699
doi: 10.20965/ijat.2011.p0694
(2011)

Paper:

Measurement and Decapsulation of IC Molding Resin Using YAG Laser for Failure Analysis

Nagayoshi Kasashima and Tsuneo Kurita

Ingenious Micro-Manufacturing System Group, Advanced Manufacturing Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), AIST Tsukuba East, 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan

Received:
April 1, 2011
Accepted:
May 19, 2011
Published:
September 5, 2011
Keywords:
laser processing, laser measurement, optical measurement, motion control, IC failure analysis
Abstract

We are now developing a laser decapsulation technique of IC molding resin for failure analysis. Laser machining shortens decapsulation process time and reduces adverse environment effects compared to conventional etching methods. However, pure laser decapsulation cannot avoid the damage of IC chips. Therefore, it is necessary to leave molding resin on the chip surface. In this paper, the decapsulation experiment results using a YAG laser are described. In addition, to estimate residual molding thickness, the method of measuring laser light-reflection intensity is proposed. The relation between molding thickness and light-reflection intensity was examined by irradiating a low-output processing laser. And the results of measurement and decapsulation experiments using an experimental system are also described.

Cite this article as:
N. Kasashima and T. Kurita, “Measurement and Decapsulation of IC Molding Resin Using YAG Laser for Failure Analysis,” Int. J. Automation Technol., Vol.5, No.5, pp. 694-699, 2011.
Data files:
References
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Last updated on Nov. 08, 2019