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IJAT Vol.5 No.1 pp. 52-59
doi: 10.20965/ijat.2011.p0052
(2011)

Paper:

Electrochemical Spark Micromachining: Present Scenario

Anjali V. Kulkarni*, Vijay Kumar Jain*, and Krishna Avtar Misra**

*Indian Institute of Technology Kanpur, Kanpur-208016, UP, India

**HBTI Kanpur, Kanpur-208016, UP, India

Received:
November 15, 2010
Accepted:
December 10, 2010
Published:
January 5, 2011
Keywords:
ECSMM, electrochemical spark micromachining, PDMS, surface treatment, surface morphology
Abstract

The electrochemical spark process, alternately known as the electrochemical discharge process or sparkassisted chemical engraving process, is emerging as a viable machining process. Though it emerged accidentally, has been found to be useful in the machining of wide variety of materials. The process has received global attention mainly because of its applicability to electrically non-conducting materials. Many researchers have investigated the process, especially its spark formation mechanism, its hydrogen gas evolution together with its bubble formation mechanism, and its material-removal mechanism. With our intensive experimental research investigations, we have tried to understand the underlying phenomena during the process. With this information, we announce its application to the micromachining of a wide range of materials, including copper, tungsten, molybdenum, glass, quartz, and silicon, among others. With the careful design of the experimental setup, tool material selection, power supply selection, and the in-house development of an automated 5-DOF machine, we have been able to achieve micro-level machining, deposition, and surface modification. These phenomena can be achieved simultaneously or one at a time. Simultaneous surface treatment, micromachining, and copper deposition on a silicon wafer, are achieved using this process. A novel metrology technique based on replica making using polymeric material is devised to measure the depth and width of the microchannels produced using ElectroChemical Spark MicroMachining (ECSMM). This metrology technique is prominent in the study of surface morphology.

Cite this article as:
A. Kulkarni, V. Jain, and K. Misra, “Electrochemical Spark Micromachining: Present Scenario,” Int. J. Automation Technol., Vol.5, No.1, pp. 52-59, 2011.
Data files:
References
  1. [1] H. Kurafuji, K. Suda, “Electrical discharge drilling of glass,” Ann. CIRP 16, 415-419, 1968.
  2. [2] I. M. Crichton and J. A. McGough, “Studies of the discharge mechanisms in electrochemical arc machining,” J. of Appl. Electrochemistry, Vol.15, pp. 113-119, 1985.
  3. [3] H. Tsuchiya, T. Inove, and M. Miyazaki, “Wire electrochemical discharge machining of glasses and ceramics,” Bull. Jpn. Soc. Prec. Eng. 19(1), 73-74, 1985.
  4. [4] K. Allesu, “Electrochemical Discharge Phenomenon in Manufacturing Processes,” PhD Thesis, Indian Institute of Technology, Kanpur, 1988.
  5. [5] K. Allesu, A. Ghosh, and M. K. Muju, “Preliminary qualitative approach of a proposed mechanism of material removal in electrical machining of glass,” European J. Mech. Eng. 36, p. 202, 1992.
  6. [6] I. Basak, “Electrochemical Discharge Machining Mechanism and a Scheme for Enhancing Material Removal Capacity,” PhD Thesis, Indian Institute of Technology, Kanpur,1991.
  7. [7] I. Basak and A. Ghosh, “Mechanism of material removal in electrochemical discharge machining: a theoretic model and experimental verification,” J. Mater. Process. Technology Vol.71, pp. 350-359, 1997.
  8. [8] I. Basak and A. Ghosh, “Mechanism of spark generation during electrochemical discharge machining: a theoretical model and experimental investigation,” J. of Materials Processing Technology Vol.62, pp. 46-53, 1996.
  9. [9] A. Ghosh, P. K. Mishra, A. Saraf, and P. Saha, “A feasibility study of using electrochemical deposition for rapid prototyping,” Proc. of 18th AIMTDR conf., pp. 328-333, 1998.
  10. [10] M. Karnik, R. Shekhar, and A. Ghosh, Proc. of the 7th Japan-India Joint seminar, Tokyo, 111-118, 2004.
  11. [11] K. Chikamori, “Grooving on silicon nitride ceramics with arc discharge in electrolyte,” Int. J. Jpn. Soc. Prec. Eng. 25(2), 109-110, 1991.
  12. [12] V. K. Jain, P. S. Rao, S. K. Chowdhury, and K. P. Rajurkar, “Experimental investigations into traveling wire electrochemical spark machining (TWECSM) of composites,” Trans. ASME Eng. Ind. 113, 75-84, 1991.
  13. [13] Y. P. Singh, V. K. Jain, P. Kumar, and D. C. Agrawal, “Machining piezoelectric (PZT) ceramics using electrochemical spark machining process,” J. of Materials Processing Technology Vol.58, pp. 24-31, 1996.
  14. [14] N. Gautam and V. K. Jain, “Experimental Investigations into ECSD Process Using Various Tool Kinematics,” Int. J. Machine Tools & Manufacture, Vol.38, No.1, pp. 15-27, 1998.
  15. [15] V. K. Jain, P. M. Dixit, and P. M. Pandey, “On the Analysis of Electrochemical Spark Machining Process,” Int. J. Mach. Tools & Manufacture, Vol.39, No.1, pp. 165-186, 1999.
  16. [16] V. K. Jain, S. K. Choudhury, and K. M. Ramesh, “On the machining of alumina and glass,” Int. J. Machine Tools & Manufacture, Vol. 42, pp. 1269-1276, 2002.
  17. [17] V. K. Jain and S. K. Chak, “Electro Chemical Spark Trepanning of Alumina and Quartz,” Machining Science & Technology.
  18. [18] R. Wuthrich, V. Fascio, D. Viquerat, and H. Langen, “In Situ Mesaurement and Micromachining of Glass,” Int. Symposium on Micromechatronic and Human Science, 185-191, 1999.
  19. [19] V. Fascio, R. Wüthrich, H. Bleuler, “Spark assisted chemical engraving in the light of electrochemistry,” Electrochimica Acta, Vol.49, pp. 3997-4003, 2004.
  20. [20] R. Wuthrich, “Micromachininq Using Electrochemical Discharge Phenomenon,” © 2009 William Andrew Inc.,
    ISBN: 978-0-8155-1587-6.
  21. [21] S. K. Sorkhel, B. Bhattacharyya, S. Mitra, and B. Doloi, “Development of electrochemical discharge machining technology for machining of advanced ceramics,” Int. Conf. on Agile Manufacturing, pp. 98-103, 1996.
  22. [22] B. Bhattacharyya, B. Doloi, S. Mitra, and S. K. Sorkhel, “Experimental analysis on the electrochemical discharge machining (ECDM) system for advanced ceramics,” Int. Conf. on Precision Engineering, ICPE, Taipei, Taiwan, pp. 715-720, 1997.
  23. [23] B. Bhattacharyya, B. N. Doloi, and S. K. Sorkhel, “Experimental investigations into electrochemical discharge machining (ECDM) of non-conductive ceramic materials,” J. of Materials Processing Technology Vol.95, pp. 145-154, 1999.
  24. [24] W. Y. Peng, Y. S. Liao, “Study of electrochemical discharge machining technology for slicing non-conductive brittle materials,” J. of Materials Processing Technology Vol.149, pp. 363-369, 2004.
  25. [25] B. G. Skrabalak, M. Z. Skrabalak, and A. Ruszaj, “Building of rules base for fuzzy-logic control of the ECDM process,” J. of Materials Processing Technology Vol.149, pp. 530-535, 2004.
  26. [26] A. V. Kulkarni, “An experimental study of discharge mechanism in ECDM,” M.Tech. Thesis, IIT Kanpur, Kanpur, India, 2000.
  27. [27] A. Kulkarni, R. Sharan, and G. K. Lal, “An Experimental Study of Discharge Mechanism in Electrochemical Discharge Machining,” Int. J. of Machine Tools and Manufacture, Vol.42, Issue10, 2002.
  28. [28] A. Kulkarni, “Sensor Based Parametric Study of ECDM Process,” DRDO Sponsored NCST conference Proc., New Delhi, India, 2002.
  29. [29] A. Kulkarni, R. Sharan, and G. K. Lal, “Measurement of Temperature Transients in Electrochemical Discharge Machining Process,” Measurement and Control in Science and Industry, Vol.7, edited by D. C. Ripple, Vol.684 in the AIP, 2003.
  30. [30] A. V. Kulkarni and M. G. Karnik, “Experimental Measurements and Theoretical Estimation of Temperature in ECDM Process,” Int. conf. on MEMS, NANO, and Smart Systems, IEEE Computer Society, Banff, Alberta, Canada, Aug. 2004.
  31. [31] A. V. Kulkarni, “Electro Chemical Discharge Machining Process,” Defence Science J., Vol.57, No.5, pp. 765-770, Sept. 2007.
  32. [32] A. V. Kulkarni, “Systematic analysis of electrochemical discharge process,” Int. J. Machining and Machinability of Materials, Vol.6, No.3/4, pp. 194-211, 2009.
  33. [33] A. V. Kulkarni, V. K. Jain, “Microfabrication using electrochemical spark,” Proc. of Indo-Japan workshop, IIT Kanpur, Feb. 21-25, 2005.
  34. [34] A. Kulkarni, V. K. Jain, K. A. Misra, and P. Saxena, “Complex Shaped Micro-channel Fabrication using Electrochemical Spark,” Proc. Of the 2nd Int. and 23rd AIMTDR Conf. Shanmugam and Ramesh Babu, Eds, pp. 653-658, 2008.
  35. [35] A. Kulkarni, V. K. Jain, and K. A. Misra, “Traveling Down the Microchannels: Fabrication and Analysis,” 2010 IEEE/ASME Int. Conf. on Advanced Intelligent Mechatronics, Montréal, Canada, July 6-9, 2010.
  36. [36] A. V. Kulkarni, V. K. Jain, and K. A. Misra, “Electrochemical spark micromachining (microchannels and microholes) of metals and non-metals,” Int. J. Manufacturing Technology and Management, In press.
  37. [37] A. V. Kulkarni, V. K. Jain, and K. A. Misra, “Simultaneous Microchannel Formation and Copper Deposition on Silicon along with Surface Treatment,” to be presented in IEEM 2010 int. conf. in Macao during 7-10 Dec. 2010.
  38. [38] A. Kulkarni, V. K. Jain, and K. A. Misra, “Development of a Novel Technique to Measure Depth of Micro-channels: A Practical Approach for Surface Metrology,” Proc. of the 3rd Int. Conf. on Advances in Mechanical Engineering, S.V. National Institute of Technology, Surat, 2010.
  39. [39] URL: http://dst.gov.in/scientific-programme/ser-nsti.htm
    retrived on 12 Nov. 2010
  40. [40] URL: http://nanomission.gov.in/Org_stru.htm
    retrived on 12 Nov. 2010
  41. [41] URL:http://scholarship-positions.com/indo-us-visitingfellowships-in-nanotechnology-ibm-iusstf/2008/06/13/
    retrived on 12 Nov. 2010
  42. [42] URL: http://home.iitk.ac.in/˜vkjain
    retrived on 12 Nov. 2010
  43. [43] URL: http://www.me.iitb.ac.in/˜micromcing
    retrived on 12 Nov. 2010

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