IJAT Vol.5 No.1 pp. 45-51
doi: 10.20965/ijat.2011.p0045


Plasma Temperature and Electron Density of Dry µ-EDM on Stainless Steel and Silicon: A Comparison

Kanmani Subbu Subbian*, Ramkumar Janakarajan*,
and Dhamodaran Santhanagopalan**

*Department of Mechanical Engineering, Indian Institute of Technology Kanpur, Uttar Pradesh, Kanpur, India

**Department of Physics, Indian Institute of Technology Kanpur, Uttar Pradesh, Kanpur, India

October 12, 2010
December 15, 2010
January 5, 2011
dry µ-EDM, silicon, stainless steel, discharge plasma, crater
Fabricating micro/nano-features in devices and largescale production with short lead times is challenging, and many individual and hybrid processes have been developed to meet this challenge. Among nonconventional processes, micro-electric discharge machining (µ-EDM) has many advantages due to the possibility of precise and accurate 2D and 3D machining of complex shapes. Dry µ-EDM is used to process assembled or semi-assembled products. Attempts are being made to improve the µ-EDM process, and further improvement is possible through better understanding the role of discharge plasma in the machining process. We studied plasma and crater characteristics during dry µ-EDM, calculating plasma parameters for different discharge energies using optical emission spectroscopy. Line pair method and modified Saha equations are used to calculate plasma temperature and electron density respectively. Craters were morphologically analyzed using scanning electron microscopy (SEM), and plasma and crater characteristics on stainless steel and silicon were compared.
Cite this article as:
K. Subbian, R. Janakarajan, and D. Santhanagopalan, “Plasma Temperature and Electron Density of Dry µ-EDM on Stainless Steel and Silicon: A Comparison,” Int. J. Automation Technol., Vol.5 No.1, pp. 45-51, 2011.
Data files:
  1. [1] L. Alting, F. Kimura et al., “Micro Enginering,” Ann. CIRP, 52-2, pp. 635-657, 2003.
  2. [2] M. Imbaby and K. Jiang, “Fabrication Process of 3D Micro Components from Stainless Steel Aqueous Slurry,” Proc. of the World Congress on Engineering, WCE2009, July 1-3, London, U.K., 2009.
  3. [3] D. Reynaerts, W. Meeusen et al., “Microstrcturing of Silicon by Electro-Discharge Machining (EDM)-Part I: Theory,” Sens. Actuators, 60, pp. 212-218, 1997.
  4. [4] P.-H. Heeran, D. Reynaerts et al., “Microstrcturing of Silicon by Electro-Discharge Machining (EDM)-Part II: Applications,” Sens. Actuators, 61, pp. 379-386, 1997.
  5. [5] D. Dornfeld, S. Min et al., “Recent Advances in Mechanical Micromachining,” Ann. CIRP, 55-2, pp. 745-768, 2006.
  6. [6] T. Masuzawa, “State of the Art of Micromachining,” Ann. CIRP, 49-2, pp. 473-487, 2000.
  7. [7] M. Kunieda, M. Yoshida et al., “Electrical Discharge Machining in Gas,” Ann. CIRP, 46, pp. 143-146, 1997.
  8. [8] M. A. Lieberman and A. J. Lichtenberg, “Principles of Plasma Discharge and Materials Processing,” John Wiley, New York, 1994.
  9. [9] K. Albinski, K. Musiol et al., “The Temperature of a Plasma Used in Electrical Discharge Machining,” Plasma Sources Sci. Technol., 5, pp. 736-742, 1996.
  10. [10] W. Natsu, S. Ojima et al., “Temperature Distribution Measurement in EDM Arc Plasma Using Spectroscopy,” JSME Int. J. Series C, 47-1, pp. 384-390, 2004.
  11. [11] M. Kunieda and T. Kobayashi, “Clarifying Mechanism of Determining Tool Electrode Wear Ratio in EDM Using Spectroscopic Measurement of Vapour Density,” J. Mater. Process Technol., 149, pp. 284-288, 2004.
  12. [12] Descoeurdes, “Characterization of electrical discharge machining plasmas,” Dissertation, Ecole polytechnique federale de Lausanne, 2006.
  13. [13] A. Kojima, W. Natsu et al., “Spectroscopic Measurement of Arc Plasma Diameter in EDM,” Ann. CIRP, 57, pp. 203-207, 2008.
  14. [14] Sandeep Dhanik and Suhas S. Joshi, “Modeling of a Single Resistance Capacitance Pulse Discharge in Micro-Electro Discharge Machining,” J. Manuf. Sci. Engg, 127, pp. 759-767, 2005.
  15. [15] Matweb, material property data,
  16. [16] Y. S. Wong, M. Rahman et al., “Investigation of Micro-EDM Material Removal Characteristics Using single RC-pulse Discharges,” J. Mat. Proc. Tech., 140, pp. 303-307, 2003.
  17. [17] H. R. Griem, “Plasma spectroscopy,” Cambridge University press, United Kingdom, 1997.
  18. [18] Kurucz atomic line database (Harvard-Smithsonian center for Astrophysics),
  19. [19] O. Djilianova, M. J. Sadowski et al., “The cu Spectra as a Tool for Late Plasma Focus Diagnostics,” J. Phys. Conf. ser., 44, pp.175-178, 2006.
  20. [20] W. Natsu, M. Shimoyamada et al., “Study on Expansion Process of EDM Arc Plasma.” JSME Inter. J. Ser. C, 49-2, pp. 600-605, 2006.
  21. [21] M. Khaleeq-ur-Rahman, Muhammad Shahbaz Anwar et al., “Laser Induced Exfoliational Splashing in Glass materials,” Nucl. Instrum. Methods. Phys. Res., 255, pp. 338-342, 2007.
  22. [22] L. Wei, M. Vaudin et al., “Heat Conduction in Silicon Thin Films : Effect of Microstructure,” Mater. Res. Society, 10, pp. 1889-1896, 1995.
  23. [23] S. H. Yeo, W. Kurnia et al., “Electrode-Thermal Modeling of Anode and Cathode in Micro-EDM,” J. Phys. D: Applied Phys., 40, pp. 2513-2521, 2007.

*This site is desgined based on HTML5 and CSS3 for modern browsers, e.g. Chrome, Firefox, Safari, Edge, Opera.

Last updated on Jun. 05, 2023