IJAT Vol.4 No.3 pp. 284-290
doi: 10.20965/ijat.2010.p0284


Simulation of Laser Micromachining in Silica Glass with Absorbent Slurry

Ippei Kono, Naohiko Sugita, and Mamoru Mitsuishi

The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku Tokyo, Japan

December 15, 2009
February 13, 2010
May 5, 2010
laser beam machining, glass, 3 dimensional micromachining

The authors are studying a method of machining a 3D microchannel in silica glass using a UV nanosecond pulsed laser and an absorbent slurry. 3D microstructures in glass materials are required for optical waveguides, microfluidic chips, etc. The depths of the grooves and holes produced in the silica glass have been proportional to the number of laser pulses. The paper reports the results of a simulation of laser micro machining in silica class with absorbent slurry. The results are that the material removal process in the proposed method is the melting of the glass by heat transfer from the absorbent particles, which are attached to the surface of the glass, providing for strong laser absorption.

Cite this article as:
I. Kono, N. Sugita, and M. Mitsuishi, “Simulation of Laser Micromachining in Silica Glass with Absorbent Slurry,” Int. J. Automation Technol., Vol.4, No.3, pp. 284-290, 2010.
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Last updated on Nov. 18, 2019