Simulation of Laser Micromachining in Silica Glass with Absorbent Slurry

Ippei Kono; Naohiko Sugita; Mamoru Mitsuishi

doi:10.20965/ijat.2010.p0284

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IJAT Vol.4 No.3 pp. 284-290

doi: 10.20965/ijat.2010.p0284

(2010)

Paper:

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Simulation of Laser Micromachining in Silica Glass with Absorbent Slurry

Ippei Kono, Naohiko Sugita, and Mamoru Mitsuishi

The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku Tokyo, Japan

Received:

December 15, 2009

Accepted:

February 13, 2010

Published:

May 5, 2010

Keywords:

laser beam machining, glass, 3 dimensional micromachining

Abstract

The authors are studying a method of machining a 3D microchannel in silica glass using a UV nanosecond pulsed laser and an absorbent slurry. 3D microstructures in glass materials are required for optical waveguides, microfluidic chips, etc. The depths of the grooves and holes produced in the silica glass have been proportional to the number of laser pulses. The paper reports the results of a simulation of laser micro machining in silica class with absorbent slurry. The results are that the material removal process in the proposed method is the melting of the glass by heat transfer from the absorbent particles, which are attached to the surface of the glass, providing for strong laser absorption.

Cite this article as:

I. Kono, N. Sugita, and M. Mitsuishi, “Simulation of Laser Micromachining in Silica Glass with Absorbent Slurry,” Int. J. Automation Technol., Vol.4, No.3, pp. 284-290, 2010.

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References

[1] K. Sugioka, “The Front of Laser Micromachining of Transparent Materials,” Proceedings of the 61th Laser Materials Processing Conference, pp. 62-68, 2004 (in Japanese).
[2] W. Watanabe and K. Itoh, “Fabrication of micro-optical devices inside glass with femtosecond laser pulses,” Proceedings of the 57th Laser Materials Processing Conference, pp. 7-19, 2002 (in Japanese).
[3] M. Mitsuishi, N. Sugita, I. Kono, and S. Warisawa, “Analysis of Laser Micromachining in Silica Glass with an Absorbent Slurry,” Annals of the International Institution for Production Engineering Research (CIRP Annals.), Vol.57/1, pp. 217-222, 2008.
[4] Y. Kawaguchi, T. Sato, A. Narazaki, R. Kurosaki, and H. Niino, “Etching a Micro-Trench with a Maximum Aspect Ratio of 60 on Silica Glass by Laser-Induced Backside Wet Etching (LIBWE),” Japanese Journal of Applied Physics, Vol.44, No.5, pp. L176-L178, 2005.
[5] S. Matsuyama, M. Kunieda, and Satsuta, “Influence of Physical Properties of Workpiece Material on Laser Piercing Difficulty,” Journal of Japan Society for Precision Engineering, Vol.66, No.5, pp. 699-703, 2000 (in Japanese).
[6] K. Yamada, Y. Odani, and T. Ueda, “Temperature and Absorptivity of Workpiece in CO2 Laser Processing,” Journal of Japan Society for Precision Engineering, Vol.65, No.1, pp. 126-130, 1999 (in Japanese).
[7] The Ceramic Society of Japan, “Handbook of Ceramic Engineering,” GIHODO SHUPPAN, p.454, 2002 (in Japanese).
[8] The Editorial Committee for Fine Ceramics Handbook, “Handbook of Fine Ceramics,” GIHODO SHUPPAN, pp. 69-148, 1987 (in Japanese).
[9] Japan Technology Transfer Association,“ Handbook of Rare Metal,” pp. 194-201, 1991 (in Japanese).

This article is published under a Creative Commons Attribution-NoDerivatives 4.0 Internationa License.

[1] [1] K. Sugioka, “The Front of Laser Micromachining of Transparent Materials,” Proceedings of the 61th Laser Materials Processing Conference, pp. 62-68, 2004 (in Japanese).

[2] [2] W. Watanabe and K. Itoh, “Fabrication of micro-optical devices inside glass with femtosecond laser pulses,” Proceedings of the 57th Laser Materials Processing Conference, pp. 7-19, 2002 (in Japanese).

[3] [3] M. Mitsuishi, N. Sugita, I. Kono, and S. Warisawa, “Analysis of Laser Micromachining in Silica Glass with an Absorbent Slurry,” Annals of the International Institution for Production Engineering Research (CIRP Annals.), Vol.57/1, pp. 217-222, 2008.

[4] [4] Y. Kawaguchi, T. Sato, A. Narazaki, R. Kurosaki, and H. Niino, “Etching a Micro-Trench with a Maximum Aspect Ratio of 60 on Silica Glass by Laser-Induced Backside Wet Etching (LIBWE),” Japanese Journal of Applied Physics, Vol.44, No.5, pp. L176-L178, 2005.

[5] [5] S. Matsuyama, M. Kunieda, and Satsuta, “Influence of Physical Properties of Workpiece Material on Laser Piercing Difficulty,” Journal of Japan Society for Precision Engineering, Vol.66, No.5, pp. 699-703, 2000 (in Japanese).

[6] [6] K. Yamada, Y. Odani, and T. Ueda, “Temperature and Absorptivity of Workpiece in CO2 Laser Processing,” Journal of Japan Society for Precision Engineering, Vol.65, No.1, pp. 126-130, 1999 (in Japanese).

[7] [7] The Ceramic Society of Japan, “Handbook of Ceramic Engineering,” GIHODO SHUPPAN, p.454, 2002 (in Japanese).

[8] [8] The Editorial Committee for Fine Ceramics Handbook, “Handbook of Fine Ceramics,” GIHODO SHUPPAN, pp. 69-148, 1987 (in Japanese).

[9] [9] Japan Technology Transfer Association,“ Handbook of Rare Metal,” pp. 194-201, 1991 (in Japanese).