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IJAT Vol.4 No.3 pp. 284-290
doi: 10.20965/ijat.2010.p0284
(2010)

Paper:

Simulation of Laser Micromachining in Silica Glass with Absorbent Slurry

Ippei Kono, Naohiko Sugita, and Mamoru Mitsuishi

The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku Tokyo, Japan

Received:
December 15, 2009
Accepted:
February 13, 2010
Published:
May 5, 2010
Keywords:
laser beam machining, glass, 3 dimensional micromachining
Abstract

The authors are studying a method of machining a 3D microchannel in silica glass using a UV nanosecond pulsed laser and an absorbent slurry. 3D microstructures in glass materials are required for optical waveguides, microfluidic chips, etc. The depths of the grooves and holes produced in the silica glass have been proportional to the number of laser pulses. The paper reports the results of a simulation of laser micro machining in silica class with absorbent slurry. The results are that the material removal process in the proposed method is the melting of the glass by heat transfer from the absorbent particles, which are attached to the surface of the glass, providing for strong laser absorption.

Cite this article as:
I. Kono, N. Sugita, and M. Mitsuishi, “Simulation of Laser Micromachining in Silica Glass with Absorbent Slurry,” Int. J. Automation Technol., Vol.4, No.3, pp. 284-290, 2010.
Data files:
References
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Last updated on Nov. 18, 2019