Simulation of Laser Micromachining in Silica Glass with Absorbent Slurry
Ippei Kono, Naohiko Sugita, and Mamoru Mitsuishi
The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku Tokyo, Japan
The authors are studying a method of machining a 3D microchannel in silica glass using a UV nanosecond pulsed laser and an absorbent slurry. 3D microstructures in glass materials are required for optical waveguides, microfluidic chips, etc. The depths of the grooves and holes produced in the silica glass have been proportional to the number of laser pulses. The paper reports the results of a simulation of laser micro machining in silica class with absorbent slurry. The results are that the material removal process in the proposed method is the melting of the glass by heat transfer from the absorbent particles, which are attached to the surface of the glass, providing for strong laser absorption.
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