Tactile Based Active Sensing for Detecting Stiffness and Contact Point Using Robotic Finger
Tatsuya Shirai*, Nobuaki Imamura**, Toshio Fukuda***
and Makoto Kaneko****
*Sony Co., Ltd., 6-7-35 Kitashinagawa, Shinagawa-ku, Tokyo, 141, Japan
**Shinko Research Co., Ltd, 1-5-5, Takatsukadai, Nishi-ku, Kobe, 651-22, Japan
***Department of Microsystem Engineering, Nagoya University, Furo-cho 1, Chikusa-ku, Nagoya, 464-01, Japan
****Faculty of Engineering, Hiroshima University, Kagamiyama, 1-4-1 Higashihiroshima, Hiroshima, 724, Japan
This paper discusses an approach for detecting not only a contact point between an environment and a robotic finger, but also the local stiffness of the environment where the finger makes contact. We assume that the environment’s stiffness is three-dimensional with coupling terms, whereas most conventional studies have assumed a one-dimensional spring as an environment model for simplification. When a finger confirms that there exists considerable compliance, the finger tip is pressed against the environment and starts several active pushing motions in various directions to eventually obtaining the measured stiffness matrix. The overall concept is also verified by experiments utilizing a wire-driven robotic finger.
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