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JDR Vol.3 No.6 pp. 479-502
(2008)
doi: 10.20965/jdr.2008.p0479

Paper:

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The Next Generation of Seismic Isolation
Going Beyond Seismic Design Dominated by Earthquakes

Mitsuo Miyazaki

Dynamic Design Inc., ISE Building 3F, 1-16 Sumiyoshi-cho, Shinjuku-ku, Tokyo, Japan

Received:
July 11, 2008
Accepted:
August 19, 2008
Published:
December 1, 2008
Creative Commons License
Keywords:
seismic isolation, seismic design, response spectrum, strong earthquake ground motion, long period structure
Abstract
Seismic isolation can provide superior building safety and dynamic response during strong earthquakes, however, performance is only assured below the design earthquake intensity level. This paper opens with a study of observed strong, near-source ground motions and long-period earthquake waves proposed by researchers. Through the examination of a widerange of earthquake response and input energy spectra, up to a period of 100 seconds, the most suitable range of damping values and isolation periods are found. The optimal period range is further confirmed by evaluating earthquake-wave amplification features during propagation from bedrock to the ground surface. Three types of next-generation seismic isolation systems are proposed along with new parameters to evaluate the dynamic response of seismically isolated structures. By comparing the dynamic response performance of four isolation systems, including a "conventional" 4-second period system, the superior seismic performance of the three next-generation isolation systems is confirmed. The paper shows the direction for a new generation of seismically isolated structures, with periods exceeding 10 seconds, and which minimize the elastic strain energy stored in the structure. Seismically isolated structures possessing these properties will survive strong earthquake input regardless of the uncertainty inherent in earthquake ground motions.
Cite this article as:
M. Miyazaki, “The Next Generation of Seismic Isolation
Going Beyond Seismic Design Dominated by Earthquakes,” J. Disaster Res., Vol.3 No.6, pp. 479-502, 2008.
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