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IJAT Vol.16 No.6 pp. 696-703
doi: 10.20965/ijat.2022.p0696
(2022)

Technical Paper:

Life Cycle Analysis of Material Efficiency Strategies for Network Goods

Ana Maria Galindo Serrano*,† and Mikko Samuli Vaija**

*Orange Innovation Networks
46 Av. de la République, Châtillon 92320, France

Corresponding author

**Orange Innovation Networks, Cesson Sévigné, France

Received:
March 11, 2022
Accepted:
June 6, 2022
Published:
November 5, 2022
Keywords:
life cycle assessment, circular economy, material efficiency, ICT network equipment
Abstract

Life cycle assessment (LCA) is the internationally adopted tool to assess environmental footprint. However, as highlighted by Billstein et al. [3] and Arushanyan [4] carrying out an LCA for ICT equipment is a challenging task due, to the amount of data that should be collected to achieve accurate results. This paper describes how documents such as full materials declarations can be used to solve this issue. Furthermore, the circular economy concept is introduced by analyzing alternative business models and the ITU-T L.1023 on circular economy scoring. Even if LCA was considered as a criterion in the L.1023 the link is not always straightforward between these two methods. Hence, this paper investigates how LCA results can be linked to the L.1023 criteria and proposes new criteria, for instance on recycled metals content and modularity.

Cite this article as:
A. Serrano and M. Vaija, “Life Cycle Analysis of Material Efficiency Strategies for Network Goods,” Int. J. Automation Technol., Vol.16, No.6, pp. 696-703, 2022.
Data files:
References
  1. [1] ITU-T L.1023, “Assessment method for circular scoring,” 2020. https://www.itu.int/rec/T-REC-L.1023-202009-I [Accessed September 25, 2022]
  2. [2] A. S. G. Andrae, M. S. Vaija, and S. Halgand, “Method for determining the Circularity Score of ICT goods,” Int. J. Adv. Res. Eng. Manag., Vol.6, No.1, pp. 1-15, 2020.
  3. [3] T. Billstein, A. Björklund, and T. Rydberg, “Life Cycle Assessment of Network Traffic: A Review of Challenges and Possible Solutions,” Sustainability, Vol.13, No.20, 11155, doi:10.3390/su132011155, 2021.
  4. [4] Y. Arushanyan, “LCA of ICT solutions: environmental impacts and challenges of assessment,” KTH Royal Institute of Technology, 2013.
  5. [5] European Commission, “European Platform on Life Cycle Assessment,” Environmental Footprint package, 3.0, 2019. https://eplca.jrc.ec.europa.eu/LCDN/developerEF.xhtml [Accessed September 25, 2022]
  6. [6] M. Ercan, J. Malmodin, P. Bergmark, E. Kimfalk, and E. Nilsson, “Life Cycle Assessment of a Smartphone,” Proc. of ICT for Sustainability 2016, pp. 124-133, doi: 10.2991/ict4s-16.2016.15, 2016.
  7. [7] IPC (former Institute for Interconnecting and Packaging Electronic Circuits), “Materials Declaration Management Standard,” IPC-1752A Class D, 2018. https://www.ipc.org/materials-declaration-data-exchange-standards-homepage [Accessed September 25, 2022]
  8. [8] S. Shikata, “Potential and Challenges of Diamond Wafer Toward Power Electronics,” Int. J. Automation Technol., Vol.12, No.2, pp. 175-178, doi: 10.20965/ijat.2018.p0175, 2018.
  9. [9] Caly-Technologies, “Die Per Wafer Calculator and Die Yield Calculator.” https://caly-technologies.com/die-yield-calculator/ [Accessed September 25, 2022]
  10. [10] L. van Oers, A. de Koning, J. B. Guinée, and G. Huppes, “Abiotic resource depletion in LCA: Improving Characterisation Factors From Abiotic Depletion as Recommended in the New Dutch Lca Handbook,” Road and Hydraulic Engineering Institute, 2002.
  11. [11] International Telecommunication Union (ITU), “L.1024: The potential impact of selling services instead of equipment on waste creation and the environment,” 2021. https://www.itu.int/rec/T-REC-L.1024-202101-I/en [Accessed September 25, 2022]
  12. [12] J. Kurilova-Palisaitiene and E. Sundin, “Challenges and Opportunities of Lean Remanufacturing,” Int. J. Automation Technol., Vol.8, No.5, pp. 644-652, doi: 10.20965/ijat.2014.p0644, 2014.
  13. [13] S. Hasegawa, Y. Kinoshita, T. Yamada, M. Inoue, and S. Bracke, “Disassembly Reuse Part Selection for Recovery Rate and Cost with Lifetime Analysis,” Int. J. Automation Technol., Vol.12, No.6, pp. 822-832, doi: 10.20965/ijat.2018.p0822ITU-T, 2018.
  14. [14] K. Yoda, H. Irie, Y. Kinoshita, T. Yamada, S. Yamada, and M. Inoue, “Remanufacturing Option Selection with Disassembly for Recovery Rate and Profit,” Int. J. Automation Technol., Vol.14, No.6, pp. 930-942, doi: 10.20965/ijat.2020.p0930, 2020.
  15. [15] S. Fukushige, Y. Inoue, K. Tonoike, and Y. Umeda, “Design Methodology for Modularity Based on Life Cycle Scenario,” Int. J. Automation Technol., Vol.3, No.1, pp. 40-48, doi: 10.20965/ijat.2009.p0040, 2009.
  16. [16] European Commission, “Communication from the Commission to the European Parliament, the Council, the European Economic and Social Committee and the Committee of the Regions – Critical Raw Materials Resilience: Charting a Path towards greater Security and Sustainability,” 2020.
  17. [17] M. S. Vaija and P. Eric, “The importance scarce materials for information and communications technology: The case of Orange,” Responsabilité & environnement, N° 99, 2020. http://www.annales.org/re/2020/resumes/juillet/04-re-resum-FR-AN-juillet-2020.html#04FR [Accessed September 25, 2022]
  18. [18] H. Ramon, J. R. Peeters, W. Sterkens, J. R. Duflou, K. Kellens, and W. Dewulf, “Techno-economic potential of recycling Tantalum containing capacitors by automated selective dismantling,” Procedia CIRP, Vol.90, pp. 421-425, doi: 10.1016/j.procir.2020.01.110, 2020.
  19. [19] G. Foo, S. Kara, and M. Pagnucco, “An Ontology-Based Method for Semi-Automatic Disassembly of LCD Monitors and Unexpected Product Types,” Int. J. Automation Technol., Vol.15, No.2, pp. 168-181, doi: 10.20965/ijat.2021.p0168, 2021.
  20. [20] International Electrotechnical Commission, “IEC 62474 – Material Declaration for Products of and for the Electrotechnical Industry.”
  21. [21] International Electrotechnical Commission, “IEC IEC 82474-1 ED1 Material declaration – Part 1: General requirements.”
  22. [22] S. Yamada, T. Yamada, S. Bracke, and M. Inoue, “Upgradable Design for Sustainable Manufacturer Performance and Profitability and Reduction of Environmental Load,” Int. J. Automation Technol., Vol.10, No.5, pp. 690-698, doi: 10.20965/ijat.2016.p0690, 2016.
  23. [23] H. Murata, N. Yokono, S. Fukushige, and H. Kobayashi, “A Lifecycle Simulation Method for Global Reuse,” Int. J. Automation Technol., Vol.12, No.6, pp. 814-821, doi: 10.20965/ijat.2018.p0814, 2018.

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Last updated on Dec. 01, 2022