Special Issue on High Performance Abrasive Technologies
Takazo Yamada, Kazuhito Ohashi, Hirofumi Suzuki, and Akinori Yui
Chiyoda-ku, Tokyo, Japan
Kita-ku, Okayama, Japan
Matsumoto, Kasugai, Japan
Kanagawa-ku, Yokohama, Japan
Demand for the high-precision and high-efficiency machining of hard ceramics, such as silicon carbide for semiconductors and hardened steel for molding dies, has significantly increased for optical and medical devices as well as for powered devices in automobiles. Certain types of hard metals can be machined by deterministic precision-cutting processes. However, hard and brittle ceramics, hardened steel for molds, and semiconductor materials have to be machined using precision abrasive technologies, such as grinding, polishing, and ultrasonic vibration technologies that use diamond super abrasives. The machining of high-precision components and their molds/dies using abrasive processes is very difficult due to their complex and nondeterministic natures as well as their complex textured surfaces. Furthermore, the development of new cutting-edge tools or machining methods and the active use of physicochemical phenomena are key to the development of high-precision and high-efficiency machining.
This special issue features 11 research papers on the most recent advances in precision abrasive technologies. These papers cover the following topics:
– Characteristics of abrasive grains in creep-feed grinding
– Quantitative evaluation of the surface profiles of grinding wheels
– ELID grinding using elastic wheels
– Nano-topographies of ground surfaces
– Novel grinding wheels
– Grinding characteristics of turbine blade materials
– Polishing mechanisms
– Polishing technologies using magnetic fluid slurries
– Application of ultrasonic vibration machining
– Turning and rotary cutting technologies
This issue is expected to help its readers to understand recent developments in abrasive technologies and to lead to further research.
We deeply appreciate the careful work of all the authors, and we thank the reviewers for their incisive efforts.
This article is published under a Creative Commons Attribution-NoDerivatives 4.0 Internationa License.