IJAT Vol.13 No.6 pp. 736-742
doi: 10.20965/ijat.2019.p0736

Technical Paper:

Visualization of Stress Distribution by Photoelastic Method Under Ultrasonic Grinding Condition

Hiromi Isobe*,†, Natsuki Sasada*, Keisuke Hara**, and Jun Ishimatsu***

*Nagaoka University of Technology
1603-1 Kamitomioka, Nagaoka, Niigata 940-2188, Japan

Corresponding author

**National Institute of Technology, Ichinoseki College, Ichinoseki, Japan

***Universiti Teknologi Malaysia, Kuala Lumpur, Malaysia

March 21, 2019
June 24, 2019
November 5, 2019
ultrasonic vibration, difficult-to-cut material, photo-elasticity, stress distribution, computed tomography

This study investigates phenomena in ultrasonic vibration-assisted grinding. The appropriateness of a stress visualization method is proven through comparison of a Hertzian contact stress analysis using finite element methods. The stress distribution on soda-lime glass caused by a 3-mm-diameter diamond electro-deposited wheel is visualized using a photo-elasticity method. The study compares the local stress concentrations caused by grains with and without ultrasonic wheel vibration. The global reaction force is measured by a dynamometer. The ultrasonic vibration leads to a reduced fluctuation of force, as well as a reduced time-averaged force. It is thought that the ultrasonic vibration causes a smaller local stress beneath the grains, which generates chips. In contrast, typical photo-elasticity methods are applicable for plane stress conditions. However, the stress distribution in a workpiece under a face grinding condition is distributed three-dimensionally, and the stress distribution cannot be recognized directly from the phase difference. Assuming that the stress distribution is sufficiently stable in a wheel rotation, continuously-captured images can be reconstructed to produce a 3D stress distribution, using computed tomography. The experimental tomographic images show a spatially-dispersed phase difference image caused by the electro-deposited wheel, with several discontinuous diamond grains on the end face of the wheel.

Cite this article as:
H. Isobe, N. Sasada, K. Hara, and J. Ishimatsu, “Visualization of Stress Distribution by Photoelastic Method Under Ultrasonic Grinding Condition,” Int. J. Automation Technol., Vol.13, No.6, pp. 736-742, 2019.
Data files:
  1. [1] J. Ishimatsu, A. Iwaita, and H. Isobe, “Grinding a hard-to-grind materials with ultrasonic-assisted fluid,” Int. J. Automation Tech., Vol.8, No.3, pp. 478-483, 2014.
  2. [2] K. Hara, H. Isobe, and A. Kyusojin, “Effects of cutting edge truncation on ultrasonically assisted grinding,” Key Engineering Material, Vols.389-390, pp. 368-374, 2008.
  3. [3] K. Noma, Y. Takeda, Y. Kakinuma, T. Aoyama, and S. Hamada, “A study on processing characteristics of chemically strengthened glass using ultrasonic vibration assisted helical milling,” 2014 Spring Meeting of JSPE, p. 103, 2014.
  4. [4] G. F. Gao, B. Zhao, F. Jiao, and C. S. Liu, “Research on the characteristics of the cutting force in the vibration cutting of a particle-reinforced metal matrix composites SiCp/Al,” J. Mater. Process. Tech., Vol.129, Nos.1-3, pp. 96-199, 2002.
  5. [5] R. Mumhammad, A. Maurotto, A Roy, and V. Silberschmidt, “Hot ultrasonically assisted turning of β-Ti alloy,” Procedia CIRP, Vol.1, pp. 336-341, 2012.
  6. [6] K. Hara and H. Isobe, “Effect of cutting speed on ultrasonically added turning in soft magnetic stainless steel,” Adv. Mater. Res., Vol.806, pp. 390-393, 2015.
  7. [7] M. Fujimoto, Y. Wu, M. Nomura, H. Kanai, and M. Jin, “Surface Topography of Mini-Size Diamond Wheel in Ultrasonic Assisted Grinding,” Int. J. Automation Tech., Vol.8, No.4, pp. 569-575, 2014.
  8. [8] M. Fujimoto, Y. Wu, M. Nomura, H. Kanai, and M. Jin, “Wear Behavior of Grain Cutting Edge in Ultrasonic Assisted Grinding Using Mini-Size Wheel,” Int. J. Automation Tech., Vol.9, No.4, pp. 365-372, 2015.
  9. [9] H. Isobe and K Hara, “Visualization of Fluctuations in Internal Stress Distribution of Workpiece During Ultrasonic Vibration-assisted Cutting,” Prec. Eng., Vol.48, pp. 331-337, 2017.
  10. [10] H. Hidai, R. Hasegawa, Y. Horie, A. Chiba, S. Matsusaka, T. Onuma, and N. Morita, “Dynamic Observation of Internal Stress and Crack Formation Process by Indentation on the Glass,” J. Jpn. Soc. Prec. Eng., Vol.83, No.4, pp. 381-386, 2017.
  11. [11] D. E. Brehl and T. A. Dow, “Review of Vibration-assisted Machining,” Prec. Eng., Vol.32, pp. 153-172, 2007.
  12. [12] R. Neugebauer and A. Stoll, “Ultrasonic Application in Drilling,” J. of Material Processing Technology, Vol.149, pp. 633-639, 2004.
  13. [13] S. S. F. Chang and G. M. Bone, “Burr Size Reduction in Drilling by Ultrasonic Assistance,” Robotics and Computer-Integrated Manufacturing, Vol.21, pp. 442-450, 2005.
  14. [14] B. Azarhoushang and J. Akabari, “Ultrasonic-assisted drilling of Inconel 738-LC,” Int. J. Machine Tools and Manuf., Vol.47, pp. 1027-1033, 2008.
  15. [15] Y. S. Liao, Y. C. Chen, and H. M. Lin, “Feasibility Study of the Ultrasonic Vibration Assisted Drilling of Inconel Superalloy,” Int. J. of Machine Tools and Manuf., Vol.47, pp. 1988-1996, 2007.
  16. [16] J. D. Kim and I. H. Choi, “Characteristics of Chip Generation by Ultrasonic Vibration Cutting with Extremely Low Cutting Velocity,” Int. J. of Advanced Manufacturing Technology, Vol.14, pp. 2-6, 1998.
  17. [17] T. Onuma and Y. Otani, “A dynamic measurement system for two-dimensional birefringence distribution with sub-millisecond time resolution,” J. Jpn. Soc. Prec. Eng., Vol.78, No.12, pp. 1082-1087, 2012.
  18. [18] E. Umezaki, “Stress Distribution Measurement Techniques Using Photoelasticity: Current Status and Future Prospects,” J. Jpn. Soc. Prec. Eng., Vol.79, No. 7, pp. 607-611, 2013.
  19. [19] A. Kumabe and K. Yamamoto, “Study on behavior of cutting strain in ductile material by photoelastic coating method,” J. Jpn. Soc. Prec. Eng., Vol.54, No.11, pp. 2144-2148, 1988.
  20. [20] M. Takahashi, N. Okabe, and N. Izumi, “Contact Strength and Probabilistic Estimation of Glass,” J. Soc. Mat. Sci., Vol.53, No.2, pp. 175-181, 2004.
  21. [21] Y. Bisrat and S. G. Roberts, “Residual stress measurement by Hertzian indentation,” Mat. Sci. Eng. A., Vol.288, No.2., pp. 148-153, 2000.
  22. [22] P. Bandyopadhyay and A. K. Mukhopadhyay, “Role of shear stress in scratch deformation of soda-lime-silica glass,” J. Non-crystalline Solids, Vol.362, pp. 101-113, 2013.
  23. [23] E. Baird and G. Taylor, “X-ray micro computed-tomography,” Current Biology, Vol.27, No.8, pp. 289-291, 2017.

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Last updated on Feb. 17, 2020