IJAT Vol.13 No.3 pp. 397-406
doi: 10.20965/ijat.2019.p0397

Technical Paper:

Using Ultraprecision Machining to Fabricate LED Packaging Exhibiting High Luminous Intensity

Ding-Chin Chou*1, Shang-Hui Yang*1, Jian-Shian Lin*2,†, Fuh-Shyang Juang*3, and Yoshimi Takeuchi*4

*1Graduate Institute of Design, National Taipei University of Technology
No.1, Sec.3, Zhongxiao E. Rd., Taipei 10608, Taiwan

*2Metal Industries Research & Development Centre, Taipei, Taiwan

Corresponding author

*3Institute of Electro-Optical and Materials Science, National Formosa University, Yunlin, Taiwan

*4Chubu University, Kasugai, Japan

December 28, 2017
November 20, 2018
May 5, 2019
LED packaging optical design, remote phosphor, ultraprecision machining, microstructure

In this study, a phosphor was coated on a microstructured film to achieve light control. This process resulted in a large-area phosphor film and enabled the microstructure to be packaged directly into the LED body. Thus, the LEDs retain their air and water barrier functions, control light, achieve higher forward luminous intensity, and have a wider scope of applications. Roll-to-roll processing was performed to mold a microstructure and phosphor on polyethylene terephthalate (PET) film by applying ultraviolet light. This approach expedited the preparation of a large-area phosphor film and enabled the precise control of the thickness and evenness of the phosphor layer, thus ensuring uniform light distribution and eliminating the yellow halo within the light body induced by the uneven thickness of the phosphor layer. The experimental results revealed that the luminous intensity of the LED to which the microstructured PET film was attached at 0° (center) increased by 11.88% relative to the luminous intensity of the LED without the film. Moreover, at 30° to −30°, the luminous intensity of the LED with the film improved by 10.36%. Therefore, the device retained its color uniformity and achieved higher forward luminous intensity.

Cite this article as:
D. Chou, S. Yang, J. Lin, F. Juang, and Y. Takeuchi, “Using Ultraprecision Machining to Fabricate LED Packaging Exhibiting High Luminous Intensity,” Int. J. Automation Technol., Vol.13, No.3, pp. 397-406, 2019.
Data files:
  1. [1] N. R. Taskar, R. N. Bhargava, J. Barone, V. Chhabra, V. Chabra, D. Dorman, A. Ekimov, S. Herko, and B. Kulkarni, “Quantum-Confined-Atom-Based Nanophosphors for Solid State Lighting,” Proc. of SPIE, Vol.5187, pp. 133-141, 2004.
  2. [2] H. K. Fu, C. W. Lin, T. T. Chen, C. L. Chen, P. T. Chou, and C. J. Sun, “Investigation of Dynamic Color Deviation Mechanisms of High Power Light-Emitting Diode,” Microelectronics Reliability, Vol.52, pp. 866-871, 2012.
  3. [3] J. K. Kim, H. Luo, E. F. Schubert, J. Cho, C. Sone, and Y. Park, “Strongly Enhanced Phosphor Efficiency in GaInN White Light-Emitting Diodes using Remote Phosphor Configuration and Diffuse Reflector Cup,” Japanese J. of Applied Physics, Vol.44, No.21, pp. L649-L651, 2005.
  4. [4] N. Narendran, “Improved Performance White LED,” Proc. of SPIE 5th Int. Conf. on Solid State Lighting, Vol.5941, pp. 45-50, 2005.
  5. [5] D. Y. Kang, E. Wu, and D. M. Wang, “Modeling White Light-Emitting Diodes with Phosphor Layers,” Applied Physics Letters, Vol.89, 231102, 2006.
  6. [6] Y. H. Song, E. K. Ji, S. H. Bak, Y. N. Kim, D. B. Lee, M. W. Jung, B. W. Jeong, and D. H. Yoon, “New Design of Hybrid Remote Phosphor with Single-Layer Graphene for Application in High-Power LEDs,” Chemical Engineering J., Vol.287, pp. 511-515, 2016.
  7. [7] T. Güner, D. Koseoglu, and M. M. Demir, “Multilayer Design of Hybrid Phosphor Film for Application in LEDs,” Optical Materials, Vol.60, pp. 422-430, 2016.
  8. [8] J. P. You, N. T. Tran, and F. G. Shi, “Light Extraction Enhanced White Light-Emitting Diodes with Multi-Layered Phosphor Configuration,” Optics Express, Vol.18, Issue 5, pp. 5055-5060, 2010.
  9. [9] K. C. Huang, W. J. Lu, K. Y. Liao, T. C. Tsai, T. H. Lai, G. J. Sheu, and Y. L. Li, “White LED Featuring Remote Phosphor with Poly (Vinylidenefluoride-Co-Hexafluoropropylene),” Materials Letters, Vol.122, pp. 265-268, 2014.
  10. [10] D. Zhang and B. Li, “A Multi-Layer Phosphor Package of White-Light-Emitting Diodes with High Efficiency,” Optik, Vol.121, pp. 2224-2226, 2010.
  11. [11] “Improved Predictive Modeling of White LEDs with Accurate Luminescence Simulation and Practical Inputs TracePro’s Fluorescence Property Utility.” [Accessed May 9, 2017]
  12. [12] Y. H. Won, H. S. Jang, K. W. Cho, Y. S. Song, D. K. Jeon, and H. K. Kwon, “Effect of Phosphor Geometry on the Luminous Efficiency of High-Power White Light-Emitting Diodes with Excellent Color Rendering Property,” Optics Letters, Vol.34, No.1, pp. 1-3, 2009.
  13. [13] J. Jia, A. Zhang, D. Li, X. Liu, B. Xua, and H. Jia, “Preparation and Properties of the Flexible Remote Phosphor Film for Blue Chip-Based White LED,” Materials and Design, Vol.102, pp. 8-13, 2016.
  14. [14] Z. Lin, H. Lin, J. Xu, F. Huang, H. Chen, B. Wang, and Y. Wang, “Highly Thermal-Stable Warm w-LED Based on Ce:YAG PiG Stacked with a Red Phosphor Layer,” J. of Alloys and Compounds, Vol.649, pp. 661-665, 2015.
  15. [15] R. Xiang, X. Liang, Q. Xi, Z. Yuan, C. Chen, and W. Xiang, “A Chromaticity-Tunable White Led by Screen-Printing Red Phosphor Coating on Pig Plates,” Ceramics Int., Vol.42, pp. 19285-19291, 2016.
  16. [16] S. R. Tseng, H. F. Meng, K. C. Lee, and S. F. Horng, “Multilayer Polymer Light-Emitting Diodes by Blade Coating Method,” Applied Physics Letters, Vol.93, 153308, 2008.
  17. [17] S. H. Yang, J. S. Lin, F. S. Juang, D. C. Chou, M. H. Chung, C. M. Chen, and L. C. Liu, “White Light Emitting Diodes (LEDs) with Good Color Rendering Indices (CRI) and High Luminous Efficiencies by the Encapsulation of Mixed and Double-Deck Phosphors,” Current Applied Physics, Vol.13, pp. 931-934, 2013.
  18. [18] J. S. Lin, W. L. Tai, C. L. Lai, and Y. Takeuchi, “New Daylight Panel Design Using Ultra-Precision Machining,” Int. J. Automation Tecnol., Vol.3, No.1, pp. 89-98, 2009.
  19. [19] J. S. Lin, C. L. Lai, H. J. Lin, Y. C. Tu, and Y. Takeuchi, “Optical Mold Cleaning Using Carbon Dioxide,” Int. J. Automation Tecnol., Vol.4, No.1, pp. 523-546, 2010.
  20. [20] J. S. Lin, W. L. Tai, C. L. Lai, and Y. Takeuchi, “A Uniform Pressure Apparatus for Micro/Nanoimprint Lithography Equipment,” Int. J. Automation Tecnol., Vol.3, No.1, pp. 84-89, 2009.

*This site is desgined based on HTML5 and CSS3 for modern browsers, e.g. Chrome, Firefox, Safari, Edge, IE9,10,11, Opera.

Last updated on May. 20, 2019