IJAT Vol.13 No.2 pp. 237-245
doi: 10.20965/ijat.2019.p0237


Study on Polishing Characteristics of Pyramidal Structured Polishing Pad

Ryunosuke Sato*,† and Yoshio Ichida**

*Graduate School of Engineering, Utsunomiya University
7-1-2 Yoto, Utsunomiya, Tochigi 321-8585, Japan

Corresponding author

**CBN & Diamond Nanomachining Institute, Utsunomiya, Japan

July 30, 2018
January 17, 2019
March 5, 2019
pyramidal structured polishing pad, polishing characteristics, true polishing pressure, removal rate, surface roughness

We conducted a polishing test to clarify the change in polishing characteristics resulting from the wear of a pyramidal-structured polishing tool, and discuss the polishing mechanism unique to the pyramidal-structured polishing pad. When the pyramidal-structured polishing pad is used for polishing, there exists an initial polishing stage in which the removal rate is high but the finished surface is rough; followed by a steady-state polishing stage in which the wear rate is low, removal rate is stable, and a high-quality finish is obtained. The true polishing pressure is constant in the steady-state polishing stage regardless of the nominal polishing pressure, although it differs with workpiece hardness. Polishing was carried out using the pyramidal-structured polishing pad containing 6 μm alumina abrasive grains for 90 min without any scorching or clogging. This resulted in finished surfaces of 0.4 μm Rz and 0.07 μm Rz for oxygen-free copper and S45C, respectively.

Cite this article as:
R. Sato and Y. Ichida, “Study on Polishing Characteristics of Pyramidal Structured Polishing Pad,” Int. J. Automation Technol., Vol.13 No.2, pp. 237-245, 2019.
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Last updated on May. 10, 2024