Polycrystalline diamond (PCD) tools are widely used for cutting tools because PCD has no crystal orientation and is an isotropic material, it is low in cost, and it is easily machined by electric discharge machining. PCD is sintered from diamond abrasives with an alloy metal, such as cobalt, and it is difficult to reduce the surface roughness and the edge accuracy compared with single crystal diamond. In this study, high efficiency and high precision machining of the PCD wheel were investigated. In the experiments, PCD wheels were ground with a diamond wheel, and the effects of the grinding direction and the load on the tool preciseness and the scribing performance were examined.

1. [1] K. Yamamoto, N. Hasaka, H. Morita, and E. Ohmura, “Influence of glass substrate thickness in laser scribing of glass,” Precision Engineering, Vol.34, pp. 55-61, 2010.
2. [2] C. H. Tsai and B. W. Huang, “Diamond scribing and laser breaking for LCD glass substrates,” J. of Materials Processing Technogy, Vol.198, pp. 350-358, 2008.
3. [3] T. B. Thoe, D. K. Aspinwall, M. L. H. Wise, and I. A. Oxley, “Polycrystalline diamond edge quality and and surface integrity following electrical discharge grinding,” J. of Materials Processing Technology, Vol.56, pp. 773-785, 1996.
4. [4] H. Sumiya, T. Irifune, A. Kurio, S. Sakamoto, and T. Inoue, “Microstructure features of polycrystalline diamond synthesized directly from graphite under static high pressure,” J. of Materials Science, Vol.39, pp. 445-450, 2004.
5. [5] T. Irifune, A. Kurio, S. Sakamoto, T. Inoue, and H. Sumiya, “Ultrahard polycrystalline diamond from graphite,” Nature, Vol.421, pp. 599-600, 2003.
6. [6] K. Harano, T. Satoh, and H. Sumiya, “Cutting performance of nano-polycrystalline diamond,” Diamond and Related Materials, Vol.24, pp. 78-82, 2012.
7. [7] Y. Akiyama, M. Okada, Y. Masuda, H. Suzuki, T. Fukunishi, Y. Asai, N. Ogasawara, K. Iizawa, and N. Tomei, “Study on scribing characteristics of wafer with precision of ground scribing wheel,” Proc. of euspen’s 17th Int. Conf. & Exhibition, Hannover, pp. 271-272, 2017.
8. [8] Y. S. Liao, G. M. Yang, and Y. S. Hsu, “Vibration assisted scribing process on LCD glass substrate,” Int. J. of Machine Tools & Manufacture, Vol.50, pp. 532-537, 2010.
9. [9] N. Tomei, K. Murakami, T. Hashimoto, M. Kitaichi, S. Hirano, and T. Fukunishi, “Development of a Scribing Wheel for Cutting Ceramic Substrates and its Wheel Scribing and Breaking Technology,” J. of the Japan Society for Abrasive Technoligy, Vol.59, No.12, pp. 705-710, 2015 (in Japanese).
10. [10] J. Fujiwara, K. Wakao, and T. Miyamoto, “Influence of Tungsten-Carbide and Cobalt on Tool Wear in Cutting of Cemented Carbides with Polycrystalline Diamond Tool,” Int. J. Automation Technol., Vol.7, No.4, 2013.
11. [11] H. Suzuki, T. Furuki, M. Okada, K. Fujii, and T. Goto, “Precision Cutting of Structured Ceramic Molds with Micro PCD Milling Tool,” Int. J. Automation Technol., Vol.5, No.3, 2011.
12. [12] Y. Miyake, “Separation Technology for FPD glass,” J. of the Japan Society for Abrasive Technoligy, Vol.45, No.7, pp. 342-347, 2001 (in Japanese).
13. [13] N. Tomei, K. Maekawa, H. Wakayama, and H. Tomimori, “A study on scribing with a breakless wheel 1st Report: Observations of crack propagation using a high-speed camera,” J. of the Japan Society for Abrasive Technology, Vol.53, No.11, pp. 684-689, 2009 (in Japanese).
14. [14] T. Ono and K. Tanaka, “Effective of Scribing Wheel Dimensions on the Cutting of AMLCD Glass Substrates,” J. of the Society for Information Display, Vol.9, pp. 87-94, 2001.
15. [15] T. Ono, “Effect of Scribing Wheel Dimensions on the Cutting of LCD Glass Substrate,” J. of the Society for Information Display, Vol.31, pp. 156-159, 2000.
16. [16] H. K. Chang, J. L. Huang, J. C. Sung, and S. R. Yang, “Newly Designed Glass Scribing Wheel Made of Chemical Vapor Deposition Diamond Film,” The American Ceramic Society, Vol.93, No.12, pp. 4122-4128, 2010.
17. [17] N. Tomei and T. Fukunishi, “Development of diamond materials for glass cutting tool,” J. of the Japan Society for Abrasive Technology, Vol.60, No.12, pp. 314-317, 2016 (in Japanase).
18. [18] T. Doi, E. Uhlmann, and L. D. Marinescu, “Handbook of Ceramics Grinding and Polishing,” Second Edition, pp. 133-233, 2015.
19. [19] K. Suzuki, Y. Shishido, and T. Uematsu, “Existing glass cutting methods and a new method utilizing repetitive indentation of a pyramid indenter,” J. of the Japan Society for Abrasive Technology, Vol.45, No.7, pp. 338-341, 2001 (in Japanese).
20. [20] Y. K. Liu and P. L. Tso, “The optimal diamond wheels for grinding diamond tools,” Int. J. of Advanced Manufacturing Technology, Vol.22, pp. 396-400, 2003.
21. [21] N. Tomei, “Cutting Technology of Glass Sheet by Scribing and Breaking,” New Glass 112, Vol.29, p. 37, 2014 (in Japanase).