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IJAT Vol.10 No.5 pp. 780-785
doi: 10.20965/ijat.2016.p0780
(2016)

Paper:

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Miniature Drilling of Chemically Strengthened Glass Plate Using Electroplated Diamond Tool

Akira Mizobuchi†, Yuki Kagawa, and Tohru Ishida

Tokushima University
2-1 Minami-josanjima-cho, Tokushima-city, Tokushima 770-8506, Japan

†Corresponding author

Received:
February 1, 2016
Accepted:
July 27, 2016
Published:
September 5, 2016
Creative Commons License
Keywords:
chemically strengthened glass, through-hole, electroplated diamond tool, chipping size
Abstract
It is well known that chemically strengthened glass plate has excellent strength and hardness properties. These characteristic properties are advantageous for the touch screens used in mobile devices. However, they are detrimental to the process of machining the glass plate. For example, chipping and crack occur around the inlet and outlet of the drilled hole, and the rate of tool wear is significant. Therefore, the surface quality and machining efficiency are low. The drilling process is extremely difficult. In this study, we describe the use of a miniature drilling method to achieve high-quality drilled holes in chemically strengthened glass plate using an electroplated diamond tool with a diameter of 1 mm or less. Using the developed tool with a diameter of 0.5 mm, it is demonstrated that the conventional drilling method can be used to drill a through-hole in the glass plate.
Cite this article as:
A. Mizobuchi, Y. Kagawa, and T. Ishida, “Miniature Drilling of Chemically Strengthened Glass Plate Using Electroplated Diamond Tool,” Int. J. Automation Technol., Vol.10 No.5, pp. 780-785, 2016.
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References
  1. [1] R. K. Brow and M. L. Schmitt, “A survey of energy and environmental applications of glass,” J. of the European Ceramic Society, Vol.29, No.7, pp. 1193-1201, 2009.
  2. [2] New Structual Materials Technologies, “Opportnities for the use of advanced ceramics and composites – a technical memorandum,” U. S. Congress, 1986.
  3. [3] H. Ohzeki and F. Arai, “Drilling of Borosilicate Glass with Feedback Control Based on Cutting Force,” Advanced Materials Research, Vol.325, pp. 442-448, 2011.
  4. [4] K. Noma, Y. Kakinuma, T. Aoyama, and S. Hamada, “Ultrasonic vibration-assisted machining of chemically strengthened glass with workpiece bending,” J. of Advanced Mechanical Design, Systems, and Manufacturing, Vol.9, No.2, pp. 1-11, 2015.
  5. [5] K. Noma, Y. Takeda, T. Aoyama, Y. Kakinuma, and S. Hamada, “High-precision and high-efficiency micromachining of chemically strengthened glass using ultrasonic vibration,” Procedia CIRP, Vol.14, pp. 389-394, 2014.
  6. [6] R. Tsuboi, Y. Kakinuma, T. Aoyama, H. Ogawa, and S. Hamada, “Ultrasonic vibration and cavitation-aided micromachining of hard and brittle materials,” Procedia CIRP, Vol.1, pp. 342-346, 2012.
  7. [7] H. Isobe, Y. Uehara, M. Okada, T. Horiuchi, and K. Hara, “Visualization of stress distribution on ultrasonic vibration aided drilling process,” J. of Advanced Mechanical Design, Systems, and Manufacturing, Vol.6, No.6, pp. 771-780, 2012.
  8. [8] K. Ishikawa, H. Suwabe, T. Nishide, and M. Ueda, “A study on combined vibration drilling by ultrasonic and low-frequency vibrations for hard and brittle materials,” Precision Engineering, Vol.22, No.4, pp. 196-205, 1998.
  9. [9] J. Wang, K. Shimada, M. Mizutani, and T. Kuriyagawa, “Material removal during ultrasonic machining using smoothed particle hydrodynamics,” Int. J. of Automation Technology, Vol.7, No.6, pp. 614-620, 2013.
  10. [10] Y. Nambu, K. Ochiai, K. Horio, J. Kaneko, T. Watanabe, and S. Matsuda, “Attempt to increase step feed by adding ultrasonic vibration in micro deep drilling,” J. of Advanced Mechanical Design, Systems, and Manufacturing, Vol.5, No.2, pp. 129-138, 2011.
  11. [11] J. Wang, P. Feng, J. Zhang, C. Zhang, and Z. Pei, “Modeling the dependency of edge chipping size on the material properties and cutting force for rotary ultrasonic drilling of brittle materials,” Int. J. of Machine Tools & Manufacture, Vol.101, pp. 18-27, 2016.
  12. [12] F. Motomura, “Micro drilling simulation of ultra-short pulsed laser ablation of glass,” Int. J. of Automation Technology, Vol.9, No.4, pp. 418-424, 2015.
  13. [13] C. Praneetpongrung, Y. Fukuzawa, S. Nagasawa, and K. Yamashita, “Effects of the edm combined ultrasonic vibration on the machining properties of Si3N4,” Materials Transactions, Vol.51, No.11, pp. 2113-2120, 2010.
  14. [14] S. Billa, M. M. Sundaram and K. P. Rajurkra, “A study on the high aspect ratio micro hole drilling using ultrasonic assisted micro-electro discharge machining,” Proc. of ASPE Spring Topical Meeting on Vibration Assisted Machining Technology, pp. 32-36, 2007.
  15. [15] M. W. Shin and J. G. Song, “Study on the photoelectrochemical etching process of semiconducting 6H–SiC wafer,” Materials Science and Engineering B, Vol.95, No.3, pp. 191-194, 2002.
  16. [16] S. Karlsson, B. Jonson, and C. Stälhandske, “The technology of chemical glass strengthening – a review,” European J. of Glass Science and Technology A, Vol.51, No.2, pp. 41-54, 2010.
  17. [17] A. Mizobuchi, I. Tada, and T. Ishida, “Development of electroplated diamond tool for fracture size minimization in miniature drilling of glass plate,” J. of the Japan Society for Abrasive Technology, Vol.58, No.5, pp. 321-327, 2014 (in Japanese).
  18. [18] A. Mizobuchi, H. Ogawa, and M. Masuda, “Drilling Conditions and Crack Restraint of Step Drilling Method in Through-Hole Drilling of Glass Plate,” J. of the Japan Society for Precision Engineering, Vol.77, No.3, pp. 296-300, 2011 (in Japanese).
  19. [19] A. Mizobuchi and H. Ogawa, “Study on Applying Cavitation in Micro Drilling of Austenite Stainless Steel – Control of Burr in Through Hole Drilling –,” Int. J. of Automation Technology, Vol.4, No.1, pp. 15-20, 2010.
  20. [20] http://abrisatechnologies.com/guide-to-glass/ [accessed Jan. 1, 2016].
  21. [21] H. Morozumi, H. Nakano, S. Yoshida, and J. Matsuoka, “Crack Initiation Tendency of Chemically Strengthened Glasses,” Int. J. of Applied Glass Science, Vol.6, No.1, pp. 64-71, 2015.
  22. [22] R. Gy, “Ion exchange for glass strengthening,” Materials Science and Engineering B, Vol.149, No.2, pp. 159-165, 2008.
  23. [23] A. Mizobuchi and H. Ogawa, “Crack size and processing efficiency in through hole drilling of glass plate using an electroplated diamond tool,” J. of the Japan Society for Abrasive Technology, Vol.54, No.3, pp. 145-150, 2010 (in Japanese).

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