Micro Imprinting for Al Alloy Using Ni-W Electroformed Mold
Manabu Yasui*, Satoru Kaneko*, Masaharu Takahashi**, Takashi Sano***, Yasuo Hirabayashi*, Takeshi Ozawa*, and Ryutaro Maeda**
*Kanagawa Industrial Technology Center
705-1, Shimoimaizumi, Ebina, Japan
**National Institute of Advanced Industrial Science and Technology (AIST), Japan
***LEAP Co., Ltd, Japan
We demonstrate the heat-resistant property of a Ni-W electroformed mold (Ni-W mold) used as the micro imprinting die for an Al alloy. To enhance the transfer performance of the Ni-W mold to A2017, we carried out micro imprinting for A2017 at 600°C. However, entire Ni-W patterns stuck to A2017. It is considered that Al, a major component of A2017, and Ni, a major component of a Ni-W mold, formed an intermetallic compound at 600°C.
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