IJAT Vol.9 No.6 pp. 674-677
doi: 10.20965/ijat.2015.p0674


Micro Imprinting for Al Alloy Using Ni-W Electroformed Mold

Manabu Yasui*, Satoru Kaneko*, Masaharu Takahashi**, Takashi Sano***, Yasuo Hirabayashi*, Takeshi Ozawa*, and Ryutaro Maeda**

*Kanagawa Industrial Technology Center
705-1, Shimoimaizumi, Ebina, Japan

**National Institute of Advanced Industrial Science and Technology (AIST), Japan

***LEAP Co., Ltd, Japan

May 13, 2015
September 16, 2015
November 5, 2015
Al alloy, imprinting, Ni-W electroformed mold
We demonstrate the heat-resistant property of a Ni-W electroformed mold (Ni-W mold) used as the micro imprinting die for an Al alloy. To enhance the transfer performance of the Ni-W mold to A2017, we carried out micro imprinting for A2017 at 600°C. However, entire Ni-W patterns stuck to A2017. It is considered that Al, a major component of A2017, and Ni, a major component of a Ni-W mold, formed an intermetallic compound at 600°C.
Cite this article as:
M. Yasui, S. Kaneko, M. Takahashi, T. Sano, Y. Hirabayashi, T. Ozawa, and R. Maeda, “Micro Imprinting for Al Alloy Using Ni-W Electroformed Mold,” Int. J. Automation Technol., Vol.9 No.6, pp. 674-677, 2015.
Data files:
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