Basic Properties of    Fixed Abrasive Polishing by Alumina Abrasive Grain for Si Wafer – Effects of Actual Contact Area and Grain Size –

Ryunosuke Sato

doi:10.20965/ijat.2014.p0592

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IJAT Vol.8 No.4 pp. 592-597

doi: 10.20965/ijat.2014.p0592

(2014)

Paper:

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Basic Properties of Fixed Abrasive Polishing by Alumina Abrasive Grain for Si Wafer – Effects of Actual Contact Area and Grain Size –

Ryunosuke Sato

Graduate school of Engineering, Utsunomiya University, 7-1-2 Yoto, Utsunomiya-shi, Tochigi 321-8585, Japan

Received:

April 15, 2014

Accepted:

June 16, 2014

Published:

July 5, 2014

Keywords:

fixed abrasive polishing, actual contact area, pyramidal structured polishing pad, alumina abrasive, Si wafer

Abstract

To investigate basic polishing properties of fixed abrasive polishing using alumina abrasive grain for Si wafer, we used a pyramidal structured polishing pad having alumina abrasives and aqueous KOH solution as the polishing fluid. We clarified that the optimum KOH solution concentration required to get a smooth surface 5 wt% and finished surface roughness of 80nmRz. The cutting edge was hardly worn and polishing performance was maintained without dressing.

Cite this article as:

R. Sato, “Basic Properties of Fixed Abrasive Polishing by Alumina Abrasive Grain for Si Wafer – Effects of Actual Contact Area and Grain Size –,” Int. J. Automation Technol., Vol.8 No.4, pp. 592-597, 2014.

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References

[1] T. Kusumi, Y. Sato, H. Ikeda, Y. Akagami, and N. Umehara, “The development of AC electric field assisted polishing for silicon carbide substrates with control of abrasive behavior – Clarification of improvement mechanism for polishing rate with electric field –,” J. of the Japan Society for Precision Engineering, Vol.79, pp. 87-92, 2013.
[2] T. Sakamoto, A. Kubota, and M. Touge, “Ultraviolet-assisted polishing of 2 inch SiC substrate,” J. of Japan Society for Abrasive Technology, Vol.57, pp. 524-529, 2013.
[3] T. Kurita, K. Miyake, K. Kawata, K. Ashida, and T. Kato, “Development of new combined polishing process for single crystal silicon carbide,” J. of Japan Society for Abrasive Technology, Vol.58, pp. 30-35, 2014.
[4] T. Ito and K. Morishge, “Polishing process automation by industrial robots with polished surface quality judged based on imaging processing,” Int. J. of Automation Technology, Vol.3, pp. 130-135, 2009.
[5] Y. Ueki, K. Morishige, T. Ishida, and Y. Takeuchi, “Automation of polishing process by industrial robots – polishing path generation in consideration of surface curvature –,” J. of the Japan Society for Precision Engineering, Vol.70, pp. 1522-1526, 2004.
[6] F. Nagata and K. Watanabe, “Feed rate control using fuzzy reasoning for a mold polishing robot,” J. of Robotics and Mechatronics, Vol.18, pp. 76-82, 2006.
[7] K. Shibuya and S. Issiki, “Evaluation of metallic mold surfaces polished by an industrial robot with stick whetstones,” Int. J. of Automation Technology, Vol.8, pp. 253-263, 2014.
[8] F. Nagata, K.Watanabe, S. Hashino, H. Tanaka, T. Matsuyama, and K. Hara, “Polishing robot using joystick controlled teaching,” J. of Robotics and Mechatronics, Vol.13, pp. 517-525, 2001.
[9] S. Kishii, R. Suzuki, A. Ohishi, and Y. Arimoto, “Completely planarized W plugs using MnO₂ CMP,” Proc. of 1995 IEEE Int. Electron Device Meeting Technical Digest, pp. 465-468, 1995.
[10] T. Doi, M. Uneda, and T. Funakoshi, “CMP slurry recycle technique and its impact,” J. of Japan Society for Abrasive Technology, Vol.56, pp. 364-367, 2012.
[11] N. Yasunaga, “The latest trend of advanced fixed abrasive finishing methods,” J. of Japan Society for Abrasive Technology, Vol.53, No.7, pp. 401-404, 2009.
[12] H. Ohmori, W. Lin, Y. Uehara, Y. Watanabe, S. Morita, T. Suzuki, and K. Katahira, “Nanoprecision micromechanical fabrication,” Int. J. of Automation Technology, Vol.2, pp. 24-33, 2008.
[13] H. Ohmori and Y. Uehara, “Development of a desktop machine tool for mirror surface grinding,” Int. J. of Automation Technology, Vol.4, pp. 88-96, 2010.
[14] L. Zhou, J. Shimizu, H. Eda, and S. Kimura, “Research on Chemo-Mechanical-Grinding (CMG) of Si wafer – 2nd report: generation of defect free surface on φ 300mm Si wafer by fixed abrasive process –,” J. of the Japan Society for Precision Engineering, Vol.71, pp. 466-470, 2005.
[15] K. Ohashi, R. Nishikawa, S. Tsukamoto, N. Tada, and T. Nakajima, “Improving process of surface roughness with super-soft grade resinoid bond wheel (2nd report) – grinding method based on the minimizing phenomenon of surface roughness –,” J. of the Japan Society for Precision Engineering, Vol.70, pp. 1291-1295, 2004.
[16] A. Takata, K. Jodan, Y. Tsuruta, K. Matsumaru, and K. Ishizaki, “The technology of fixed abrasive polishing by special diamond grinding wheels,” J. of Japan Society for Abrasive Technology, Vol.53, pp. 413-416, 2009.
[17] M. Uneda, K. Ishikawa, and H. Suwabe, “Grinding simulation with diamond pellets and optimization of layout method of pellets using genetic algorithm,” J. of the Japan Society for Precision Engineering, Vol.71, pp. 644-648, 2005.
[18] S. Katagiri, K. Yasui, U. Yamaguchi, Y. Kawamura, R. Kawai, F. Kanai, M. Tokuda, M. Honda, and S. Moriyama, “Study on STI planarization process using fixed abrasive tool (1st Report) – factor analysis to obtain flatter surface –,” J. of the Japan Society for Precision Engineering, Vol.70, No.5, pp. 128-132, 2004.
[19] Y. Wu, W. Yang, M. Fujimoto, and L. Zhou, “Mirror surface finishing of silicon wafer edge using ultrasonic assisted fixed-abrasive CMP (UF-CMP),” Int. J. of Automation Technology, Vol.7, pp. 663-670, 2013.
[20] H. Yasui and T. Sawa, “Ultra-smoothness grinding of fine ceramic by coarse grain size diamond wheel – effect of grinding fluid –,” J. of the Japan Society for Precision Engineering, Vol.70, pp. 848-852, 2004.
[21] H. Yasui and T. Sawa, “Ultra-smoothness grinding of fine ceramics by coarse grain size diamond wheel – effect of grinding fluid (continued report) –,” J. of the Japan Society for Precision Engineering, Vol.70, pp. 1423-1427, 2004.

This article is published under a Creative Commons Attribution-NoDerivatives 4.0 Internationa License.

[1] [1] T. Kusumi, Y. Sato, H. Ikeda, Y. Akagami, and N. Umehara, “The development of AC electric field assisted polishing for silicon carbide substrates with control of abrasive behavior – Clarification of improvement mechanism for polishing rate with electric field –,” J. of the Japan Society for Precision Engineering, Vol.79, pp. 87-92, 2013.

[2] [2] T. Sakamoto, A. Kubota, and M. Touge, “Ultraviolet-assisted polishing of 2 inch SiC substrate,” J. of Japan Society for Abrasive Technology, Vol.57, pp. 524-529, 2013.

[3] [3] T. Kurita, K. Miyake, K. Kawata, K. Ashida, and T. Kato, “Development of new combined polishing process for single crystal silicon carbide,” J. of Japan Society for Abrasive Technology, Vol.58, pp. 30-35, 2014.

[4] [4] T. Ito and K. Morishge, “Polishing process automation by industrial robots with polished surface quality judged based on imaging processing,” Int. J. of Automation Technology, Vol.3, pp. 130-135, 2009.

[5] [5] Y. Ueki, K. Morishige, T. Ishida, and Y. Takeuchi, “Automation of polishing process by industrial robots – polishing path generation in consideration of surface curvature –,” J. of the Japan Society for Precision Engineering, Vol.70, pp. 1522-1526, 2004.

[6] [6] F. Nagata and K. Watanabe, “Feed rate control using fuzzy reasoning for a mold polishing robot,” J. of Robotics and Mechatronics, Vol.18, pp. 76-82, 2006.

[7] [7] K. Shibuya and S. Issiki, “Evaluation of metallic mold surfaces polished by an industrial robot with stick whetstones,” Int. J. of Automation Technology, Vol.8, pp. 253-263, 2014.

[8] [8] F. Nagata, K.Watanabe, S. Hashino, H. Tanaka, T. Matsuyama, and K. Hara, “Polishing robot using joystick controlled teaching,” J. of Robotics and Mechatronics, Vol.13, pp. 517-525, 2001.

[9] [9] S. Kishii, R. Suzuki, A. Ohishi, and Y. Arimoto, “Completely planarized W plugs using MnO₂ CMP,” Proc. of 1995 IEEE Int. Electron Device Meeting Technical Digest, pp. 465-468, 1995.

[10] [10] T. Doi, M. Uneda, and T. Funakoshi, “CMP slurry recycle technique and its impact,” J. of Japan Society for Abrasive Technology, Vol.56, pp. 364-367, 2012.

[11] [11] N. Yasunaga, “The latest trend of advanced fixed abrasive finishing methods,” J. of Japan Society for Abrasive Technology, Vol.53, No.7, pp. 401-404, 2009.

[12] [12] H. Ohmori, W. Lin, Y. Uehara, Y. Watanabe, S. Morita, T. Suzuki, and K. Katahira, “Nanoprecision micromechanical fabrication,” Int. J. of Automation Technology, Vol.2, pp. 24-33, 2008.

[13] [13] H. Ohmori and Y. Uehara, “Development of a desktop machine tool for mirror surface grinding,” Int. J. of Automation Technology, Vol.4, pp. 88-96, 2010.

[14] [14] L. Zhou, J. Shimizu, H. Eda, and S. Kimura, “Research on Chemo-Mechanical-Grinding (CMG) of Si wafer – 2nd report: generation of defect free surface on φ 300mm Si wafer by fixed abrasive process –,” J. of the Japan Society for Precision Engineering, Vol.71, pp. 466-470, 2005.

[15] [15] K. Ohashi, R. Nishikawa, S. Tsukamoto, N. Tada, and T. Nakajima, “Improving process of surface roughness with super-soft grade resinoid bond wheel (2nd report) – grinding method based on the minimizing phenomenon of surface roughness –,” J. of the Japan Society for Precision Engineering, Vol.70, pp. 1291-1295, 2004.

[16] [16] A. Takata, K. Jodan, Y. Tsuruta, K. Matsumaru, and K. Ishizaki, “The technology of fixed abrasive polishing by special diamond grinding wheels,” J. of Japan Society for Abrasive Technology, Vol.53, pp. 413-416, 2009.

[17] [17] M. Uneda, K. Ishikawa, and H. Suwabe, “Grinding simulation with diamond pellets and optimization of layout method of pellets using genetic algorithm,” J. of the Japan Society for Precision Engineering, Vol.71, pp. 644-648, 2005.

[18] [18] S. Katagiri, K. Yasui, U. Yamaguchi, Y. Kawamura, R. Kawai, F. Kanai, M. Tokuda, M. Honda, and S. Moriyama, “Study on STI planarization process using fixed abrasive tool (1st Report) – factor analysis to obtain flatter surface –,” J. of the Japan Society for Precision Engineering, Vol.70, No.5, pp. 128-132, 2004.

[19] [19] Y. Wu, W. Yang, M. Fujimoto, and L. Zhou, “Mirror surface finishing of silicon wafer edge using ultrasonic assisted fixed-abrasive CMP (UF-CMP),” Int. J. of Automation Technology, Vol.7, pp. 663-670, 2013.

[20] [20] H. Yasui and T. Sawa, “Ultra-smoothness grinding of fine ceramic by coarse grain size diamond wheel – effect of grinding fluid –,” J. of the Japan Society for Precision Engineering, Vol.70, pp. 848-852, 2004.

[21] [21] H. Yasui and T. Sawa, “Ultra-smoothness grinding of fine ceramics by coarse grain size diamond wheel – effect of grinding fluid (continued report) –,” J. of the Japan Society for Precision Engineering, Vol.70, pp. 1423-1427, 2004.