Statistical Analysis for Evaluating Surface Roughness of Plane Honing
Keita Shimada, Chung-I Kuo, Masayoshi Mizutani,
and Tsunemoto Kuriyagawa
Department of Mechanical Systems and Design, Graduate School of Engineering, Tohoku University, 6-6-01 Aoba, Aramaki, Aoba-ku, Sendai, Miyagi 980-8579, Japan
Recently, fixed abrasive technologies have been needed to solve some problems with free abrasive technologies, such as processing efficiency and environmental pollution. Plane honing is one effective fixed abrasive technology for processing wafer-like materials. Advantages of plane honing include a high processing rate, slurry waste-free process, and high finishing accuracy. The paper presents a method to simulate the plane honing process based on statistical analysis of a grinding process. One of the most significant differences between grinding and plane honing is process controlling method: the former is positioncontrolled, whereas the latter is pressure-controlled processes. In order to treat a pressure-controlled process, the amount of material removed from each segment was assumed to be constant based on Preston’s law, which is the most common principle for material removal in the polishing process. Reference curves of a segment were introduced to map tip points of abrasive grains contained in the segment. The reference curve can be compared with the surface curve of the workpiece to determine the material to be removed; repeating the comparison allows the plane honing process to be simulated. Plane honing experiments were conducted, and the results agreed qualitatively with the simulation results.
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