IJAT Vol.7 No.6 pp. 708-713
doi: 10.20965/ijat.2013.p0708


Development of a Micro-Sized Thermal Contact Sensor for Inspection of Surface Defects

Yuki Shimizu, Wenjian Lu, Yuta Ohba,
and Wei Gao

Nano-Metrology and Control Laboratory, Department of Nanomechanics, Tohoku University, 6-6-01 Aramaki, Aza Aoba, Aoba-ku, Sendai, Miyagi 980-8579, Japan

March 31, 2013
August 19, 2013
November 5, 2013
contact sensor, frictional heat, defect, wafer inspection
This paper presents an experimental study on a thermal element, which is designed to be used as a sensing device that detects a small amount of frictional heat due to a contact with nanometre-scale defects on smoothly-finished surfaces. A prototype of the thermal element, which is a thin-film resistance, is fabricated by using photolithography processes, and its sensitivity on the contact detection is investigated through some experiments, in which the thermal element is scratched by a micro-sphere controlled by PZT actuator in both X- and Z-directions so that a contact between the thermal element and defects can be simulated. Influences of an interference height and relative velocity between the thermal element and the target surface on the output of the thermal element at the contact detection are verified.
Cite this article as:
Y. Shimizu, W. Lu, Y. Ohba, and W. Gao, “Development of a Micro-Sized Thermal Contact Sensor for Inspection of Surface Defects,” Int. J. Automation Technol., Vol.7 No.6, pp. 708-713, 2013.
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