IJAT Vol.7 No.6 pp. 621-629
doi: 10.20965/ijat.2013.p0621


Fabrication of Microstructures on RB-SiC by Ultrasonic Cavitation Assisted Micro-Electrical Discharge Machining

Pay Jun Liew*, ***, Keita Shimada*, Masayoshi Mizutani*,
Jiwang Yan**, and Tsunemoto Kuriyagawa*

*Department of Mechanical Systems and Design, Tohoku University, 6-6-01 Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan

**Department of Mechanical Engineering, Faculty of Science and Technology, Keio University, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama 223-8522, Japan

***Manufacturing Process Department, Faculty of Manufacturing Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia

March 31, 2013
August 5, 2013
November 5, 2013
micro-dimple array, ultrasonic cavitation, micro-electro discharge machining, carbon nanofiber, reaction-bonded silicon carbide

Ultrasonic cavitation assisted micro-electrical discharge machining was used to fabricate microstructures on reaction-bonded silicon carbide. To aid the removal of debris from the machining gap and to obtain a good surface finish, carbon nanofibers were added into the dielectric fluid. The suspension of carbon nanofibers in the dielectric fluid and the cavitation bubble effect induced by the vibration of the dielectric fluid proved to be effective in reducing the deposition of tool material on the workpiece surface. The tool material deposition rate was found to be significantly affected by the vibration amplitude and the distance between the oscillator and the workpiece. With a hemispherical electrode and inclined workpiece, high accuracy micro-dimples could be obtained within a short time. A nanometer-level surface finish was successfully obtained on a hard-brittle RB-SiCmoldmaterial.

Cite this article as:
Pay Jun Liew, Keita Shimada, Masayoshi Mizutani,
Jiwang Yan, and Tsunemoto Kuriyagawa, “Fabrication of Microstructures on RB-SiC by Ultrasonic Cavitation Assisted Micro-Electrical Discharge Machining,” Int. J. Automation Technol., Vol.7, No.6, pp. 621-629, 2013.
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Last updated on Mar. 05, 2021