Paper:
Decrease of Thermal Expansion of Ball Screw Used for Precision Positioning Devices by Peltier Module Cooling Based on Feedback Method
Ning Zhu*, Shigeomi Koshimizu**, Takashi Nozaki*,
Kenichi Taneishi***, Jiro Otsuka*, Takeki Shirai***,
Tetsuhiro Nishide***, and Tsutomu Togashi***
*Shizuoka Institute of Science and Technology, 2200-2 Toyosawa, Fukuroi, Shizuoka 437-8555, Japan
**Advanced Institute of Industrial Technology, 1-10-40 Higashi Oi, Shinagawa-ku, Tokyo 140-0011, Japan
***THK CO.,LTD, 4-9-16 Higashikoujiya, Ota-ku, Tokyo 144-0033, Japan
Many methods of cooling precision positioning devices have been proposed and some have actually been applied. This paper proposes a new method by employing Peltier modules based on feedback to cool the stage as well as the bearing. A specially-designed experimental system is established for verification. As a result of a series of experiments, it is found that the total thermal expansion of the ball screw is within 0.5 µm.
Kenichi Taneishi, Jiro Otsuka, Takeki Shirai,
Tetsuhiro Nishide, and Tsutomu Togashi, “Decrease of Thermal Expansion of Ball Screw Used for Precision Positioning Devices by Peltier Module Cooling Based on Feedback Method,” Int. J. Automation Technol., Vol.7, No.5, pp. 564-570, 2013.
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