Decrease of Thermal Expansion of Ball Screw Used for Precision Positioning Devices by Peltier Module Cooling Based on Feedback Method
Ning Zhu*, Shigeomi Koshimizu**, Takashi Nozaki*,
Kenichi Taneishi***, Jiro Otsuka*, Takeki Shirai***,
Tetsuhiro Nishide***, and Tsutomu Togashi***
*Shizuoka Institute of Science and Technology, 2200-2 Toyosawa, Fukuroi, Shizuoka 437-8555, Japan
**Advanced Institute of Industrial Technology, 1-10-40 Higashi Oi, Shinagawa-ku, Tokyo 140-0011, Japan
***THK CO.,LTD, 4-9-16 Higashikoujiya, Ota-ku, Tokyo 144-0033, Japan
Many methods of cooling precision positioning devices have been proposed and some have actually been applied. This paper proposes a new method by employing Peltier modules based on feedback to cool the stage as well as the bearing. A specially-designed experimental system is established for verification. As a result of a series of experiments, it is found that the total thermal expansion of the ball screw is within 0.5 µm.
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