IJAT Vol.6 No.5 pp. 633-637
doi: 10.20965/ijat.2012.p0633


Electroless Nickel Plating Technique for Depositing a Nano-Scale Layer

Tune-Hune Kao, Meng-Chi Huang, Ying-Tsun Su,
Jian-Shian Lin

Advanced Manufacturing Core Technology Division, Mechanical and Systems Research, Laboratories, Industrial Technology Research Institute, No.195, Sec.4, Chung Hsing Rd., Chutung, Hsinchu, 31040, Taiwan, R.O.C.

December 13, 2011
May 17, 2012
September 5, 2012
electroless plating, roller mold, EDTA, potassium sodium tartrate
This paper discusses an electroless nickel plating technique. EDTA and potassium sodium tartrate are selected as chelating agents, and both are suitable for producing deposition layers of nanometer scale. The technique is applied to a copper roller mold, the deposition rate is measured at various operation temperatures, and layer thickness is measured by a surface contour meter. The quality of the deposition layer is characterized by SEM, and micrographs show that sharp angles can be reproduced by the deposition layer.
Cite this article as:
T. Kao, M. Huang, Y. Su, and J. Lin, “Electroless Nickel Plating Technique for Depositing a Nano-Scale Layer,” Int. J. Automation Technol., Vol.6 No.5, pp. 633-637, 2012.
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