single-au.php

IJAT Vol.6 No.5 pp. 633-637
doi: 10.20965/ijat.2012.p0633
(2012)

Paper:

Electroless Nickel Plating Technique for Depositing a Nano-Scale Layer

Tune-Hune Kao, Meng-Chi Huang, Ying-Tsun Su,
Jian-Shian Lin

Advanced Manufacturing Core Technology Division, Mechanical and Systems Research, Laboratories, Industrial Technology Research Institute, No.195, Sec.4, Chung Hsing Rd., Chutung, Hsinchu, 31040, Taiwan, R.O.C.

Received:
December 13, 2011
Accepted:
May 17, 2012
Published:
September 5, 2012
Keywords:
electroless plating, roller mold, EDTA, potassium sodium tartrate
Abstract

This paper discusses an electroless nickel plating technique. EDTA and potassium sodium tartrate are selected as chelating agents, and both are suitable for producing deposition layers of nanometer scale. The technique is applied to a copper roller mold, the deposition rate is measured at various operation temperatures, and layer thickness is measured by a surface contour meter. The quality of the deposition layer is characterized by SEM, and micrographs show that sharp angles can be reproduced by the deposition layer.

Cite this article as:
T. Kao, M. Huang, Y. Su, and <. Lin, “Electroless Nickel Plating Technique for Depositing a Nano-Scale Layer,” Int. J. Automation Technol., Vol.6, No.5, pp. 633-637, 2012.
Data files:
References
  1. [1] A. H. Graham, R. W. Lindsay, H. J. Read, J. Electrochem. Soc., Vol.112, No.4, p. 401, 1965.
  2. [2] A. K. Grover, M. K. Totlani, Trans.Metal Finish, India, Vol.4, No.1, p. 15, 1995.
  3. [3] R. N. Duncan, Metal Prog, Vol.127, No.7, p. 31, 1985.
  4. [4] S. S. Tulsi, Trans. Inst. Metal Finish, Vol.64, No.2, p. 73, 1986.
  5. [5] K. Parker, Metal Finish, Vol.79, No.3, p. 29, 1992.

*This site is desgined based on HTML5 and CSS3 for modern browsers, e.g. Chrome, Firefox, Safari, Edge, IE9,10,11, Opera.

Last updated on Nov. 18, 2019