Top > IJAT > Evaluation Method Applying Fourier Transform Analysis for Cond ...

single-au.php

IJAT Vol.5 No.2 pp. 173-178
doi: 10.20965/ijat.2011.p0173
(2011)

Paper:

Views over last 60 days: 420

Evaluation Method Applying Fourier Transform Analysis for Conditioned Polishing Pad Surface Topography

Keiichi Kimura, Panart Khajornrungruang, Takahisa Okuzono,
and Keisuke Suzuki

Department of Mechanical Information Science and Technology, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka-shi, Fukuoka 820-8502, Japan

Received:
December 7, 2010
Accepted:
December 22, 2010
Published:
March 5, 2011
Creative Commons License
Keywords:
polishing pad, surface topography, Fourier transform, conditioning, CMP
Abstract
The Fourier transform analysis is proposed to quantitatively evaluate the 3D surface topography of Chemical Mechanical Polishing (CMP) pads used for flattening and smoothing processed semiconductor substrates. The conditioned polishing pad surfaces have a wide range of irregular topographies ranging from topographies of a sub-micrometer to those of a hundredmicrometer order. Hence, a Confocal Laser Scanning Microscope (CLSM), which can provide nanometer resolution in wide range of lateral directions by means of linear encoded mechanical stage translation, was employed to obtain numerical data of the three-dimensional topographic surfaces of polishing pad samples. The measured topographic surfaces were analyzed using the spatial Fourier transform. We discuss the power spectrum in the spatial wavelengths of polishing pad surfaces which were conditioned with diamond grits of various shapes. The analyzed power spectra indicated that the surface topography characteristics varied with differently shaped diamond grits of the same size. The diamond grits roughened the polishing pad surface. We also found that a rough polishing pad surface, one that was roughed in a spatial wavelength that of less than 20 micrometers, removed more material than comparatively smooth pad surfaces.
Cite this article as:
K. Kimura, P. Khajornrungruang, T. Okuzono, and K. Suzuki, “Evaluation Method Applying Fourier Transform Analysis for Conditioned Polishing Pad Surface Topography,” Int. J. Automation Technol., Vol.5 No.2, pp. 173-178, 2011.
Data files:
References
  1. [1] Planarization and CMP technical Committee, JSPE et al., Planarization Technical Term Dictionary, 2004.
  2. [2] K. Kadomura et al., “Quantification of Pad Surface Conditions with Diamond Conditioners and Polishing Characteristics in CMP Process,” Proc. of ICPT, pp. 319-324, 2009.
  3. [3] M. Oshida, S. Haba, K. Yoshida, and M. Kinoshita, “New observation technique and applied research of surface roughness for silicon polishing pad,” Proc. of 2008 JSPE Spring Conf., pp. 197-198, 2008 (in Japanese).
  4. [4] A. Lawing, “Pad Conditioning and Pad Surface Characterization in Oxide Chemical Mechanical Polishing,” Proc. of Mat. Res. Soc. Symp., pp. I5.3.1-I5.3.6, 2002.
  5. [5] Planarization and CMP technical Committee, JSPE et al., “A library of CMP planarization Technology & Application,” Global Net Corp, 2006 (in Japanese).
  6. [6] K. Kimura, Y. Hashiyama, P. Khajornrungruang, H. Hiyama, and Y. Mochizuki, “Study on material removal phenomena in CMP process,” Proc. of ICPT, pp. 201-205, 2007.
  7. [7] R.White et al., “In Situ Characterization of theMechanical Aspects of CMP,” Proc. of ICPT, pp. 3-10, 2008.
  8. [8] M. Akaji et al., “Study of optimum polishing pad surface for CMP,” Proc. of ICPT, pp. 97-102, 2009.
  9. [9] E. Okamoto, K. Kimura, and P. Khajornrungruang, “Study on kinetic contact between polishing pad and wafer during CMP,” Proc. of 2010 JSPE Spring Conf., pp. 737-738, 2010 (in Japanese).

Creative Commons License  This article is published under a Creative Commons Attribution-NoDerivatives 4.0 Internationa License.

*This site is desgined based on HTML5 and CSS3 for modern browsers, e.g. Chrome, Firefox, Safari, Edge, Opera.

Last updated on Sep. 19, 2024