Study of Printed Circuit Board Inspection System
Masanori Noguchi, Tadaatsu Satomi, Yukio Saito, and Okitoshi Tsunoda
Graduate School of Advanced Science and Technology, Tokyo Denki University
Ishizaka, Hatoyama, Saitama 350-0394, Japan
Presently, the inspection of printed wiring boards includes the conductivity, the capacitance, the appearance inspections, and so forth. There are problems of the conduction defects, the effect of the stray capacitance and the mistaken image in these inspections. In order to resolve these problems, in our research a pin probe with a dielectric substance is produced.
-  "Prime selection," Japan Electronics Packaging and Circuits Association, pp. 1-4, 1999.
-  T. Miyagoshi, D. Kacprzak, S. Yamada, and M. Iwahara, "Feasibility of Inspecting defects in Printed Circuit Boards by Using Eddy-Current Testing Techniques," Journal of the Magnetics Society of Japan, Vol.23(4-2), pp. 1613-1316, 1999.
-  N. Denda, T. Yamakawa, K. Wakui, and T. Satomi, "Development of Printed Circuit Board's Inspection-system," Proc. of JSME Annual Meeting, Vol.2003, No.6, pp. 219-220, August 2003.
-  T. Satomi and M. Noguchi, "Study of Printed Circuit Board's Inspecting System," Journal of the Japan Society of Mechanical Engineers, Vol.73(731), pp. 1911-1916, July 2007.
This article is published under a Creative Commons Attribution-NoDerivatives 4.0 Internationa License.