Packaged Sensors, Microactuators and Three-Dimensional Microfabrication
Faculty of Engineering, Tohoku University, Aza Aoba, Aramaki, Aoba-ku, Sendai, Miyagi, 980-77 Japan
Packaged micromechanical sensors were fabricated using bonded glass-silicon microstructures. These are integrated, resonant, or force-balancing sensors. Distributed electrostatic microactuator (DEMA) and three-dimensional microfabrication methods were developed.
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