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Packaged Sensors, Microactuators and Three-Dimensional Microfabrication
Masayoshi Esashi
Faculty of Engineering, Tohoku University, Aza Aoba, Aramaki, Aoba-ku, Sendai, Miyagi, 980-77 Japan
Received:February 8, 1995Accepted:February 17, 1995Published:June 20, 1995
Keywords:Packaged sensor, Integrated sensor, Microactuator, Micromachining
Abstract
Packaged micromechanical sensors were fabricated using bonded glass-silicon microstructures. These are integrated, resonant, or force-balancing sensors. Distributed electrostatic microactuator (DEMA) and three-dimensional microfabrication methods were developed.
Cite this article as:M. Esashi, “Packaged Sensors, Microactuators and Three-Dimensional Microfabrication,” J. Robot. Mechatron., Vol.7 No.3, pp. 200-203, 1995.Data files:
