Packaged Sensors, Microactuators and Three-Dimensional Microfabrication

Masayoshi Esashi

doi:10.20965/jrm.1995.p0200

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JRM Vol.7 No.3 pp. 200-203

doi: 10.20965/jrm.1995.p0200

(1995)

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Packaged Sensors, Microactuators and Three-Dimensional Microfabrication

Masayoshi Esashi

Faculty of Engineering, Tohoku University, Aza Aoba, Aramaki, Aoba-ku, Sendai, Miyagi, 980-77 Japan

Received:

February 8, 1995

Accepted:

February 17, 1995

Published:

June 20, 1995

Keywords:

Packaged sensor, Integrated sensor, Microactuator, Micromachining

Abstract

Packaged micromechanical sensors were fabricated using bonded glass-silicon microstructures. These are integrated, resonant, or force-balancing sensors. Distributed electrostatic microactuator (DEMA) and three-dimensional microfabrication methods were developed.

Cite this article as:

M. Esashi, “Packaged Sensors, Microactuators and Three-Dimensional Microfabrication,” J. Robot. Mechatron., Vol.7 No.3, pp. 200-203, 1995.

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