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JRM Vol.7 No.3 pp. 200-203
doi: 10.20965/jrm.1995.p0200
(1995)

Review:

Packaged Sensors, Microactuators and Three-Dimensional Microfabrication

Masayoshi Esashi

Faculty of Engineering, Tohoku University, Aza Aoba, Aramaki, Aoba-ku, Sendai, Miyagi, 980-77 Japan

Received:
February 8, 1995
Accepted:
February 17, 1995
Published:
June 20, 1995
Keywords:
Packaged sensor, Integrated sensor, Microactuator, Micromachining
Abstract

Packaged micromechanical sensors were fabricated using bonded glass-silicon microstructures. These are integrated, resonant, or force-balancing sensors. Distributed electrostatic microactuator (DEMA) and three-dimensional microfabrication methods were developed.

Cite this article as:
Masayoshi Esashi, “Packaged Sensors, Microactuators and Three-Dimensional Microfabrication,” J. Robot. Mechatron., Vol.7, No.3, pp. 200-203, 1995.
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