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JRM Vol.5 No.3 pp. 284-291
doi: 10.20965/jrm.1993.p0284
(1993)

Development Report:

Effect of H2O on Oxidation of Cu Contact Surface

Tetsushi Kawano and Terutaka Tamai

Hyogo University of Teacher Education, 942-1 Shimokume, Yashiro-cho, Kato-gun, Hyogo 673-14, Japan

Received:
February 10, 1993
Accepted:
February 26, 1993
Published:
June 20, 1993
Keywords:
Oxidation of Cu humidity, Contact resistance, Oxide film thickness, Electrical contacts
Abstract
Cite this article as:
T. Kawano and T. Tamai, “Effect of H2O on Oxidation of Cu Contact Surface,” J. Robot. Mechatron., Vol.5, No.3, pp. 284-291, 1993.
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Last updated on Jun. 18, 2019