JACIII Vol.26 No.3 pp. 431-440
doi: 10.20965/jaciii.2022.p0431


Dual-Level Template for Enhancing Resolution of Quantum Images

Shan Zhao*1, Fei Yan*1,†, Abdullah M. Iliyasu*2,*3, Ahmed S. Salama*4, and Kaoru Hirota*3,*5

*1School of Computer Science and Technology, Changchun University of Science and Technology
Changchun 130022, China
Al-Kharj 11942, Saudi Arabia

*3School of Computing, Tokyo Institute of Technology
Yokohama 226-8502, Japan

*4Faculty of Engineering and Technology, Future University in Egypt
New Cairo 11845, Egypt

*5School of Automation, Beijing Institute of Technology
Beijing 100081, China

Corresponding author

January 9, 2022
March 14, 2022
May 20, 2022
quantum computing, quantum image processing, image resolution enhancement, quantum wavelet transform, quantum interpolation

Quantum information science is an emerging research field devoted to the use of quantum mechanical systems to devise and implement information processing tasks faster than that possible with classical computers. In this study, two quantum image resolution enhancement (QIRE-I and QIRE-II) schemes are proposed based on quantum wavelet transform and quantum interpolation. Using these, the resolutions of low-resolution (LR) images are enhanced by decomposing them into four frequency sub-bands using a single-level one-dimensional (1-D) quantum Haar wavelet transform (QHWT). Subsequently, to preserve the edges and obtain sharper high-resolution (HR) images, quantum interpolation was applied to three of the high-frequency sub-bands. A few simulation-based demonstrations are presented to illustrate the feasibility and effectiveness of the proposed schemes. The visual and quantitative results demonstrate the superiority of the proposed schemes over those that use only quantum interpolation.

Block diagram for the two QIRE schemes

Block diagram for the two QIRE schemes

Cite this article as:
S. Zhao, F. Yan, A. Iliyasu, A. Salama, and K. Hirota, “Dual-Level Template for Enhancing Resolution of Quantum Images,” J. Adv. Comput. Intell. Intell. Inform., Vol.26 No.3, pp. 431-440, 2022.
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