Special Issue on Large-Scale Point Cloud Processing
Hiroshi Masuda and Hiroaki Date
The University of Electro-Communications
Chofugaoka, Chofu, Tokyo, Japan
Kita-ku, Sapporo, Japan
Recently, terrestrial laser scanners have been significantly improved in terms of accuracy, measurement distance, measurement speed, and resolution. They enable us to capture dense 3D point clouds of large-scale objects and fields, such as factories, engineering plants, large equipment, and transport ships. In addition, the mobile mapping system, which is a vehicle equipped with laser scanners and GPSs, can be used for capturing large-scale point clouds from a wide range of roads, buildings, and roadside objects. Large-scale point clouds are useful in a variety of applications, such as renovation and maintenance of facilities, engineering simulation, asset management, and 3D mapping. To realize these applications, new techniques must be developed for processing large-scale point clouds. So far, point processing has been studied mainly for relatively small objects in the field of computer-aided design and computer graphics. However, in recent years, the application areas of point clouds are not limited to conventional domains, but also include manufacturing, civil engineering, construction, transportation, forestry, and so on. This is because the state-of-the-art laser scanner can be used to represent large objects or fields as dense point clouds. We believe that discussing new techniques and applications related to large-scale point clouds beyond the boundaries of traditional academic fields is very important.
This special issue addresses the latest research advances in large-scale point cloud processing. This covers a wide area of point processing, including shape reconstruction, geometry processing, object recognition, registration, visualization, and applications. The papers will help readers explore and share their knowledge and experience in technologies and development techniques.
All papers were refereed through careful peer reviews. We would like to express our sincere appreciation to the authors for their submissions and to the reviewers for their invaluable efforts for ensuring the success of this special issue.
This article is published under a Creative Commons Attribution-NoDerivatives 4.0 International License.