Next-Generation, Super-Hard-to-Process Substrates and Their High-Efficiency Machining Process Technologies Used to Create Innovative Devices
Global Innovation Center, Kyushu University
6-1 Kasuga-koen, Kasuga-city, Fukuoka 816-8580, Japan
SiC, GaN, and diamond are known as super-hard-to-process substrate for next-generation green devices. In this paper, we report on some breakthrough in developing highly efficient processing for such hard-to-process materials, for which we propose improvements in conventional processing, and innovative processing. As part of our project, we developed a “dilatancy pad®” that can efficiently produce high-quality surfaces as well as a high-rigidity, high-speed and high-pressure processing machine. We also designed and prototyped “plasma fusion CMP®,” which is an innovative processing technology fusing CMP (Chemical Mechanical Polishing) with P-CVM (Plasma Chemical Vaporization Machining) to machine super-hard diamond substrates that are considered indispensable for future devices. Before the advent of “singularities” by 2045, super-hard-to-process substrates and ultra-precision polishing technology will become more and more essential.
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