Numerical Analysis of Temperature Change in Sandwich Structure During Laser Sealing
Akira Chiba†, Souta Matsusaka, Hirofumi Hidai, and Noboru Morita
Department of Mechanical Engineering, Chiba University
1-33 Yayoi-cho, Inage-ku, Chiba 263-8522, Japan
Numerical analysis revealed the thermal behavior during the laser joining of two glass plates using a low melting point glass frit as an adhesive. The proposed model is a structure consisting of a straight line glass frit sandwiched between glass plates. The numerical solutions of three associated heat equations were provided by the finite difference method. The constant heat flux model predicted the temperature at the contact interface between the glass frit pattern and the glass plate. The influence of heat source shape on temperature distribution was compared using circular and elliptical beams. Irradiation with the elliptical beam extended the softening domain of the glass frit pattern further than the circular beam. The increase in softening domain depended on the major diameter of the elliptical beam. Thermal diffusion had no influence on the glass plate domains at distances greater than 1 mm from the edge of the glass frit pattern. Laser frit sealing is an effective means of resolving the issue of heat influence on electronic devices.
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