Development of First Production Flaw Detecting System for On-Demand  Repair of Large-Scale Circuit

Ichiro Ogura; Kiwamu Ashida; Jun Akedo

doi:10.20965/ijat.2015.p0487

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IJAT Vol.9 No.5 pp. 487-493

doi: 10.20965/ijat.2015.p0487

(2015)

Paper:

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Development of First Production Flaw Detecting System for On-Demand Repair of Large-Scale Circuit

Ichiro Ogura, Kiwamu Ashida, and Jun Akedo

Advanced Manufacturing Research Institute, National Institute of Advanced Industrial Science and Technology (AIST)
1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan

Received:

January 30, 2015

Accepted:

May 18, 2015

Published:

September 5, 2015

Keywords:

on-demand repair, laser measurement, detection, circuit, flaw

Abstract

To realize an efficient high-mix low-volume production, improving the yield rate by reducing production flaws is an important technique. Manufacturing touch panel displays with large-scale wiring boards is a typical example of the high-mix low-volume production. The National Institute of Advanced Industrial Science and Technology (AIST) has proposed a laser assisted ink-jet printing (LIJ) technology, which can repair the flaws of circuits by a silver nanoparticle ink. To establish an in-process repairing system for a touch panel display, a first production flaw detecting system is necessary in combination with LIJ technology. Therefore, the aim of this study is to develop a new first production flaw detecting system, which detects flaws in a large-scale circuit quickly. In this report, we have covered the basic concept of the proposed system, and the details of some preliminary experiments conducted using the developed measurement system. The performance requirements for the first production flaw detecting system are discussed. The basic concept of the detecting system and optical set-up was finalized. A preliminary first production flaw detecting system with galvano-scanner and multi-photodiode array was developed to confirm its ability to detect flaws and pattern profile. Some basic experiments were conducted to check the performance of this system. A flaw was intentionally created by making a scratch on a circuit pattern; the experimental results showed that this flaw could be detected by the equipment. The height detection technique for this system and preliminary experiments conducted using the developed system are also covered in this report. By using the laser trigonometry method, the displacement of profile height was detected with sufficient accuracy.

Cite this article as:

I. Ogura, K. Ashida, and J. Akedo, “Development of First Production Flaw Detecting System for On-Demand Repair of Large-Scale Circuit,” Int. J. Automation Technol., Vol.9 No.5, pp. 487-493, 2015.

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References

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This article is published under a Creative Commons Attribution-NoDerivatives 4.0 Internationa License.

[1] [1] Q. Zhang and M. M. Tseng, “Modelling and integration of customer flexibility in the order commitment process for high mix low volume production,” Int. J. of Production Research, Vol.47, No.22, p. 6397, November 2009.

[2] [2] K. Kamoda et al., “Input plan optimization system for the high mix low volume factory of the semiconductor manufacturing,” Int. Symposium on Semiconductor Manufacturing, p. 70, Oct. 2010.

[3] [3] J. Zhao et al., “Integrated Production Planning, Scheduling and Shop Floor Tracking System for High-Mix Low-Volume Manufacturing – A Consortium Approach,” Key Engineering Materials, Vol.447-448, p. 306, 2010.

[4] [4] Y. Li et al., “Facile Synthesis of Silver Nanoparticles Useful for Fabrication of High-Conductivity Elements for Printed Electronics,” J. of American Chemical Society, Vol.127, No.10, p. 3266, 2005.

[5] [5] B. S. Ong et al., “High-Performance Semiconducting Polythiophenes for Organic Thin-Film Transistors,” J. of American Chemical Society, Vol.126, No.11, p. 3378, 2004.

[6] [6] J. Perelaer et al., “Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials,” J. of Materials Chemistry, Vol.20, p. 8446, 2010.

[7] [7] R. E. Taylor et al., “Planar patterned stretchable electrode arrays based on flexible printed circuits,” J. of Micromechanics and Microengineering, Vol.23, 10, p. 105004, 2013.

[8] [8] B.-I. Noh et al., “Fabrication and adhesion strength of Cu/Ni–Cr/polyimide films for flexible printed circuits,” Microelectronic Engineering, Vol.88, No.6, p. 1024, 2011.

[9] [9] R. Oron, “Performance Optimization of Electronics Circuits Laser Repair,” Proc. SPIE, Vol.8967, Laser Applications in Microelectronic and Optoelectronic Manufacturing March, p. 89671-H1, 2014.

[10] [10] G. H. Chapman, “Laser Applications to IC defect correction,” Proc. SPIE, Vol.3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III, p. 79, Jun. 1998.

[11] [11] J. Akedo and A. Endo, “High Aspect Patterning of Ag Fine Line by a Laser Assisted Ink-Jet Printing,” Proc. of 5th Int. Conf. and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Denver, Colorado, USA, April 21-23, 2009.

[12] [12] A. Endo and J. Akedo, “Development of laser-assisted inkjet printing technology,” Synthesiology – English edition Vol.4, No.1, p. 9, 2011.

[13] [13] M. Mogant et al., “Automatic PCB Inspection Algorithms: A Survey,” Computer Vision and Image Understanding, Vol.63, No.2, p. 287, 1996.

[14] [14] N. G. Shankar and Z. W. Zhong, “Defect detection on semiconductor wafer surfaces,” Microelectronic Engineering, Vol.77, No.3-4, p. 337, 2005.

[15] [15] J. Duanmu and K. Taaffe, “Measuring manufacturing throughput using takt time analysis and simulation,” Proc. of the 39^th Conf. on Winter simulation, p. 1633, 2007.

[16] [16] TAKEX TL-4 096ACL /2048ACL/2048ACLC catalogue.

[17] [17] S. Ito et al., “Measurement of Cutting Edge Width of a Rotary Cutting Tool by Using a Laser Displacement Sensor,” Int. J. of Automation Technology, Vol.8, No.1, p. 28, 2014.

[18] [18] Y. Kimura et al., “Analysis of Measurement Errors of a Diffuse-Reflection-Type Laser Displacement Sensor for Profile Measurement,” Int. J. of Automation Technology, Vol.6, No.6, p. 724, 2012.

[19] [19] Flaw detector system utilizing a laser scanner, US Patent, US3781531A, 1973.

[20] [20] G. Abe et al., “Development of On-Machine Measurement System Utilizing Line Laser Displacement Sensor,” Int. J. of Automation Technology, Vol.5, No.5, p. 708, 2011.