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IJAT Vol.8 No.3 pp. 406-419
doi: 10.20965/ijat.2014.p0406
(2014)

Paper:

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Feature-Based 3D Process Planning for MEMS Fabrication

Satoshi Kanai*, Takayuki Shibata**, and Takahiro Kawashima**

*Graduate School of Information Science and Technology, Hokkaido University, Kita-14, Nishi-9, Kita-ku, Sapporo 060-0814, Japan

**Department of Mechanical Engineering, Toyohashi University of Technology, 1-1 Hibarigaoka, Tempaku, Toyohashi, Aichi 441-8580, Japan

Received:
December 7, 2013
Accepted:
March 3, 2014
Published:
May 5, 2014
Creative Commons License
Keywords:
MEMS, surface micro machining, process planning, feature recognition, solid model
Abstract
With the fast growth of the market forMEMS (Micro-Electro-Mechanical Systems) devices, Computer-Aided Design (CAD) and Computer-Aided Process Planning (CAPP) systems for MEMS are essential for the appropriate division of labor between MEMS design and fabrication. Although several CAD systems for MEMS devices are commercially available, CAPP systems for MEMS are still underdeveloped, and few systems have been investigated. The purpose of this study is to prototype a CAPP system for MEMS for non-expert MEMS designers. MEMS device geometry, a complex layered structure made of multiple materials, is represented as a solid model called a device model. The system has twomain functions. In processextraction function, all feasible fabrication processes of the device are exhaustively derived from the device model using 3D fabrication features as clues. In manufacturable-geometry-estimation function, the expected 3D geometry of the device that will actually be fabricated by the derived process, which might differ from the original device model, is estimated. Process emulation using a commercial emulator and examination by expert researchers confirm that the derived process plans and the expected 3D geometries of the device are feasible and plausible.
Cite this article as:
S. Kanai, T. Shibata, and T. Kawashima, “Feature-Based 3D Process Planning for MEMS Fabrication,” Int. J. Automation Technol., Vol.8 No.3, pp. 406-419, 2014.
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