Patterned Self-Assembly of Fine Particles as a Proposal of Precisely Allocated Cutting-Edge Tool
Nobuyuki Moronuki, Arata Kaneko, and Ken’ichiro Takada
Faculty of System Design, Tokyo Metropolitan University, Japan, 6-6 Asahigaoka, Hino, Tokyo 191-0065, Japan
This paper discusses fine-particle self-assembly and its potential applications to abrasive tools. Dispensing suspensions containing particles on substrates, packed structures are self-assembled as solvent evaporates. Applying relative motion between the dispenser and substrate produces patterned assembly without the need for a mask. Silica particles 1 µm in size were typically assembled along lines 20 µm-100 µmwide. Diamond particles were also assembled because these also act as the cutting edge of abrasive tools. Assembled particles were transferred to another substrate using ultraviolet curing resin. The particle edge height was aligned at the same level independent of the assemblylayer number – the key to this process.
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