IJAT Vol.5 No.3 pp. 289-293
doi: 10.20965/ijat.2011.p0289


Patterned Self-Assembly of Fine Particles as a Proposal of Precisely Allocated Cutting-Edge Tool

Nobuyuki Moronuki, Arata Kaneko, and Ken’ichiro Takada

Faculty of System Design, Tokyo Metropolitan University, Japan, 6-6 Asahigaoka, Hino, Tokyo 191-0065, Japan

January 28, 2011
March 8, 2011
May 5, 2011
self-assembly, particle, abrasive, tool
This paper discusses fine-particle self-assembly and its potential applications to abrasive tools. Dispensing suspensions containing particles on substrates, packed structures are self-assembled as solvent evaporates. Applying relative motion between the dispenser and substrate produces patterned assembly without the need for a mask. Silica particles 1 µm in size were typically assembled along lines 20 µm-100 µmwide. Diamond particles were also assembled because these also act as the cutting edge of abrasive tools. Assembled particles were transferred to another substrate using ultraviolet curing resin. The particle edge height was aligned at the same level independent of the assemblylayer number - the key to this process.
Cite this article as:
N. Moronuki, A. Kaneko, and K. Takada, “Patterned Self-Assembly of Fine Particles as a Proposal of Precisely Allocated Cutting-Edge Tool,” Int. J. Automation Technol., Vol.5 No.3, pp. 289-293, 2011.
Data files:
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