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Advanced Photomask Defect Repairing Technology Using FIB and SPM
Osamu Takaoka
Mask Repair Product Department, MR Technical Group, SII Nanotechnology Inc., 36-1 Takenoshita, Oyama-cho, Sunto-gun, Shizuoka 410-1393, Japan
Received:September 3, 2007Accepted:December 14, 2007Published:January 5, 2008
Keywords:photomask, repair, FIB, AFM
Abstract
SIINT has supplied high-accuracy microprocessing devices since 1985. As photomask defects are very minute, high-accuracy positioning as well as highaccuracy processing and height-controllability to secure printability are required of such devices. Conventionally devices based on focused ion beam (FIB) technology have been adopted to meet requirements for specifications. But there remain an increasing number of defects which cannot be covered by FIB. Recently developed, therefore, is a defect-repairing system to which scanning probe microscopy (SPM) has been applied in order to make up for the shortcomings inherent in FIB. This paper is intended to report on photomask-defect-repairing system based on FIB and SPM for industrial application which requires precision-positioning.
Cite this article as:O. Takaoka, “Advanced Photomask Defect Repairing Technology Using FIB and SPM,” Int. J. Automation Technol., Vol.2 No.1, pp. 64-69, 2008.Data files:
