On the Role and Potential of Engineering Simulation

Toyoshiro Inamura

doi:10.20965/ijat.2010.p0214

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IJAT Vol.4 No.3 pp. 214-220

doi: 10.20965/ijat.2010.p0214

(2010)

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On the Role and Potential of Engineering Simulation

Toyoshiro Inamura

Graduate School of Engineering, Nagoya Institute of Technology, Gokiso-Cho, Showa-Ku, Nagoya 466-8555, Japan

Received:

March 3, 2010

Accepted:

March 10, 2010

Published:

May 5, 2010

Keywords:

CAE, molecular dynamics, mode-I crack, slip deformation, hertz indentation

Abstract

The two aspects of simulation have been discussed: simulation as a practical tool for predicting physical phenomena and simulation as a theoretical tool for carrying out research. The current state of the art in the former aspect is described in the framework of computer-aided-engineering with reference to what is being done and what should be done more. Then, the latter aspect of simulation is discussed first by considering the difference between real phenomena and simulation and then by considering the reason why simulation cannot be a tool for discovering new phenomena. Finally, a new simulation method, controlled-molecular dynamics, is introduced as a possible tool for discovering new phenomena on a microscale and/or mezzo-scale. After a description of the crucial difference between the new method and the ordinary method of simulation, several new findings obtained through this new method are briefly described.

Cite this article as:

T. Inamura, “On the Role and Potential of Engineering Simulation,” Int. J. Automation Technol., Vol.4 No.3, pp. 214-220, 2010.

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References

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[14] T. Inamura, N. Takezawa, T. Miura, and K. Yamada, “Molecular Dynamics Simulation of Dimple Formation Process on Ductile Fracture Surface,” CIRP Annals Manufacturing Technology, Vol.54, No.1, pp. 507-510, Elsevier, 2005.
[15] T. Inamura, N. Takezawa, K. Yamada, and K. Shibuya, “Molecular Dynamics Simulation of Micro Mechanisms in Slip Deformation Theory of Crystals,” CIRP Annals Manufacturing Technology, Vol.55, No.1, pp. 51-54, Elsevier, 2006.
[16] T. Inamura, Y. Shishikura, and N. Takezawa, “Mechanism of Ring Crack Initiation in Hertz Indentation of Monocrystalline Silicon Analyzed by Controlled-Molecular Dynamics,” CIRP Annals Manufacturing Technology, Vol.59, No.1, Elsevier, 2010.

This article is published under a Creative Commons Attribution-NoDerivatives 4.0 Internationa License.

[1] [1] B. Scholz-Reiter, M. Gorges, and T. Philipp, “Autonomously Controlled Production Systems-Influence of Autonomous Control Level on Logistic Performance,” CIRP Annals Manufacturing Technology, Vol.58, No.1, pp. 395-398, Elsevier, 2009.

[2] [2] O. Ceryan and Y. Koren, “Manufacturing Capacity Planning Strategies,” CIRP Annals Manufacturing Technology, Vol.58, No.1, pp. 403-406, Elsevier, 2009.

[3] [3] K. K. Hon, “Performance and Evaluation of Manufacturing Systems,” CIRP Annals Manufacturing Technology, Vol.54, No.2, pp. 675-690, Elsevier, 2005.

[4] [4] N. A. Duffie and L. Shi, “Maintaining Constant WIP-Regulation Dynamics in Production Networks with Autonomous Work Systems,” CIRP Annals Manufacturing Technology, Vol.58, No.1, pp. 399-402, Elsevier, 2009.

[5] [5] D. Biermann, M. Kersting, and N. Kesseler, “Process Adapted Structure Optimization of Deep Hole Drilling Tools,” CIRP Annals Manufacturing Technology, Vol.58, No.1, pp. 89-92, Elsevier, 2009.

[6] [6] I. Lazoglu, C. Manav, and Y.Murtezaoglu, “Tool Path Optimization for Free Form Surface Machining,” CIRP Annals Manufacturing Technology, Vol.58, No.1, pp. 101-104, Elsevier, 2009.

[7] [7] S. Ranganath, C. Guo, and P. Hegde, “A Finite Element Modeling Approach to Predicting White Layer Formation in Nickel Superalloys,” CIRP Annals Manufacturing Technology, Vol.58, No.1, pp. 77-80, Elsevier, 2009.

[8] [8] M. Arizmendi et al., “Model for Surface Topography Prediction in Peripheral Milling Considering Tool Vibration,” CIRP Annals Manufacturing Technology, Vol.58, No.1, pp. 93-96, Elsevier, 2009.

[9] [9] H. Komoto and T. Tomiyama, “Integration of a Service CAD and a Life Cycle Simulator,” CIRP Annals Manufacturing Technology, Vol.57, No.1, pp. 9-12, Elsevier, 2008.

[10] [10] A. Okada, Y. Uno, S. Onoda, and S. Habib, “Computational Fluid Dynamics Analysis of Working Fluid Flow and Debris Movement in Wire EDMed Kerf,” CIRP Annals Manufacturing Technology, Vol.58, No.1, pp. 209-212, Elsevier, 2009.

[11] [11] E.Brinksmeier et al., “Advances in Modeling and Simulation of Grinding Processes,” CIRP Annals Manufacturing Technology, Vol.55, No.2, pp. 667-696, Elsevier, 2006.

[12] [12] K. Morimoto and M. Kunieda, “Sinking EDM Simulation by Determing Discharge Locations Based on Discharge Delay Time,” CIRP Annals Manufacturing Technology, Vol.58, No.1, pp. 221-224, Elsevier, 2009.

[13] [13] P. J. Bartolo, “Computer Simulation of Stereolithographic Curing Reactions: Phenomenological Versus Mechanistic Approaches,” CIRP Annals Manufacturing Technology, Vol.55, No.1, pp. 221-225, Elsevier, 2006.

[14] [14] T. Inamura, N. Takezawa, T. Miura, and K. Yamada, “Molecular Dynamics Simulation of Dimple Formation Process on Ductile Fracture Surface,” CIRP Annals Manufacturing Technology, Vol.54, No.1, pp. 507-510, Elsevier, 2005.

[15] [15] T. Inamura, N. Takezawa, K. Yamada, and K. Shibuya, “Molecular Dynamics Simulation of Micro Mechanisms in Slip Deformation Theory of Crystals,” CIRP Annals Manufacturing Technology, Vol.55, No.1, pp. 51-54, Elsevier, 2006.

[16] [16] T. Inamura, Y. Shishikura, and N. Takezawa, “Mechanism of Ring Crack Initiation in Hertz Indentation of Monocrystalline Silicon Analyzed by Controlled-Molecular Dynamics,” CIRP Annals Manufacturing Technology, Vol.59, No.1, Elsevier, 2010.