Workspace Analysis of Parallel Manipulator for Telemicromanipulation Systems
Noriaki Ando, Masahiro Ohta, Kohei Gonda and Hideki Hashimoto
Institute of Industrial Science, University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
Received:April 23, 2001Accepted:June 29, 2001Published:October 20, 2001
Keywords:micromaripulation, teleoperation, haptic interface, parallel manipulater
This paper describes the research results on telemicromanipulation systems for microlevel tasks. Because of its better manipulation precision, stiffness and speed characteristics, the parallel mechanism micromanipulator was chosen to compose our systems. First, the kinematic analysis of our original manipulator mechanism is performed. Then, the structure of our parallel manipulator, control scheme, and experimental results are shown. Position accuracy and device control characteristics are analyzed and the feasibility of the use of parallel mechanisms for micromanipulator is then discussed. A parallel manipulator motion is restricted by 3 factors: mechanical limits of the passive joints, collision between links and actuators limitations. Results of the numerical workspace analysis considering the above factors are shown. We are proposing the use of dual manipulators for implementing improved real manipulation systems. The first kinematics and workspace analysis of dual systems using the VR simulator are also shown.
Cite this article as:N. Ando, M. Ohta, K. Gonda, and H. Hashimoto, “Workspace Analysis of Parallel Manipulator for Telemicromanipulation Systems,” J. Robot. Mechatron., Vol.13 No.5, pp. 488-496, 2001.Data files:
Copyright© 2001 by Fuji Technology Press Ltd. and Japan Society of Mechanical Engineers. All right reserved.