Shigeomi Koshimizu

Abstract:

Development of methods for handling such microparts will increasingly be needed. Microparts are commonly handled by gripping, using tweezers for example. However, this method poses difficulties in quick release, due to static electricity. Here we propose a new handling method based on liquid bridging force. The pick & place method and the assembly method using liquid bridging force for microparts are shown in this paper. Measurement results of liquid bridging force are also described. Effects of parameters such as liquid type, picking up speed and curvature of microparts were investigated.